Difference between revisions of "Laurell Spinner"

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==Checkout procedure==
 
==Checkout procedure==
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
+
# Read through this page and the [https://docs.google.com/document/d/1Kp3A7BHqHK_PZbwdd69DMjHJ19Nvh6DctSwj3d4H2yw/preview Standard Operating Procedure] above.
 
# Complete the training request form [http://examplelink.com here].
 
# Complete the training request form [http://examplelink.com here].
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.

Revision as of 12:26, 30 April 2021

Laurell Spinner
Laurell.jpg
Laurell Spinner Ws-650-23B
Equipment Details
Technology Lithography
Materials Restriction Metals
Chemicals Used Photoresist, Polyimides, PDMS, other with approval
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes SU-8 2100, 2050, 2005, 2010, Polyimide 2610 and 2611
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

The Laurell Spinner Laurell spinner is located in the ROBIN lab. A great variety of materials, that are not allowed to be spun in the clean room, can be spun here. This new tool replaces the old Solitec spinner and it is, as always, associated with the Solvent 94 bench. In order to reserve this tool users must reserve Solvent 94 bench. The main uses of this spinner are for soft lithography, polyimide processing and surface protection for dicing. There are just a few photoresist available for this tool, but users can bring private photoresist, or other spinnable materials provided they are approved.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Etch Rate
  • Resolution
  • Aspect Ratio
  • Thickness range

System overview

Hardware details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material restrictions

Template:General

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Laurell Spinner user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Process name