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The term liftoff refers to a method of metal patterning whereby the photoresist is patterned, the metal is deposited and the photoresist is removed from under the metal “lifting off” the metal where it is deposited on top of the resist. Some keys to effective liftoff processing are:
Method of operation
- The metal must be much thinner than the thickness of the resist. For standard resist, > 5:1 is required.
- For fine lines, LOR (lift off resist) is a good material for line definition. Contact a staff member for more information.
- The metal must have good adhesion to the substrate.
Heating of the resist in solvent causes the resist to swell and break any connection to the patterns. Ultrasonic will break up the metal and remove any connections between the metal on the resist and the patterns remaining.
- Evaporated materials liftoff better than sputtered
- Sputtered materials require LOR or other special methods for liftoff
- Not compatible with PECVD or other heated processes
List any external references or attachments related to this technology.