Lindbergh Convection Oven
|Lindbergh Convection Oven|
|Material Processed||No Metals allowed, PI|
|Sample Size||up to 6" wafers|
|Supported Processes||Supported Processes|
|User Processes||User Processes|
The Lindbergh Convection Oven is a...
- No announcements at this time.
The Lindbergh convection oven ( 10 oC/min) can heat up to 700 oC under a nitrogen atmosphere. The cooling is done by convection. There are thermocouples available that can allow a better measurement of the temperature inside the oven. In general this oven is dedicated to curing materials in air or nitrogen atmosphere. This oven is maintained clean to allow CMOS processes in it. Tool Engineer should authorize your materials before used. The cooling time from 600 oC to room temperature is about 5 hours.
- Gases= N2 back fill
- atmospheric pressure
- quartz sample holders
- Wafer Size = smaller pieces or 4"
- Wafer type = Si, glass
This oven is mainly dedicated to curing polymeric materials or others compatible with a semi-clean process. Please consult with the tool engineer.
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Lindbergh Convection Oven user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
- Create a Help desk Ticket requesting training.
- A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
- Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.