Logitech PM5 Lapper
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| Logitech PM5 Lapper | |
|---|---|
 Logitech PM5 Lapper | |
| Equipment Details | |
| Technology | Polishing |
| Materials Restriction | Metals |
| Material Processed | no restrictions |
| Sample Size | maximum wafer size 4", maximum sample thickness 10mm |
| Chemicals Used | Polishing slurries |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Maintenance | Maintenance |
 Warning: | This page has not been released yet. |
Precision Lapping & Polishing machine that can deliver extremely flat surfaces with integral abrasive autofeed system and integral vacuum system. The PM5 provides an extremely precise, versatile lapping and polishing capability for the research environment. The PM5 is exhausted making it suitable to lap/polish a great variety of materials including III-V semiconductors, geological samples and other environmentally sensitive materials.
Contents
Announcements
- Update this with announcements as necessary
Capabilities
The PM5 Lapping and Polishing system is a bench-top, R&D-scale machine. Highly flexible, the PM5 can be used with many different materials, including compound semiconductors, silicon, glass, quartz, metals and rocks. Designed as a single workstation machine, the PM5 has an integral abrasive autofeed system. This tool can be set for lapping mode (fixed arm) and polishing mode (oscillating arm). The different platens allow the polishing/lapping of both soft and hard materials, as well as 4" wafers, 3" wafers and odd shaped samples as large as 4", as long as they can be mounted on the carrier disc.
Materials that we have lapped:
- glass, sapphire, fused silica, etc.
- metals films
- semiconductors and dielectric
- geological samples
- III-V compounds
- Semiconductors
- Thinning commercial devices to each internal layers, etc.
- Planarize wafers
- thin wafers
System overview
The Logitech PM5 Lapping and Polishing system is a versatile tool that is suitable for polishing (including chemical mechanical polishing)/lapping a wide variety of materials and sample sizes. The mechanical or chemical polishing of any material depends strongly on its hardness and chemical nature. The Logitech PM5 allows the use of different abrasives and different polishing plates to accommodate materials with varying hardness and chemical properties. The most common slurry used is alumina in different grit sizes, but the tool also allows the use of chemically active slurries. Samples of many sizes and shapes can be polished as long as they are mounted on 3" or 4” glass carriers (available in the LNF store). The glass carriers fit in the chuck of the (CMP) machine, allowing the transfer of samples between these tools. Samples must be mounted prior to polishing, LNF offers a home designed mounting press for this purpose, it is recommended the mounting is done in advanced.
Hardware details
- Cast iron platen: grooved and non-grooved
- Glass platen: grooved and non-grooved
- Stainless steel polishing plate
- aluminum polishing plate
- 4" chuck: PP6
- 3" Chuck: PP5
- Slurry cylinders for auto feed
- CMP slurry delivering system
- Chemicals: alumina (20μm, 9μm, 3μm, 1μm, 0.30μm); SF1 colloidal silica
LNF has a home designed mounting press to help users with sample preparation.
Substrate requirements
- Wafer Size: 3", 4", and pieces provided they can be mounted on a 3" or 4" diameter glass carrier
- Wafer type: any (waste is collected, hazardous materials can be processed here)
- Smaller pieces or thin wafers must be mounted
The main restriction is the height of the mounted sample, which must not exceed 15 mm
Material restrictions
When using corrosive slurries, proper platen and slurry cylinder must be used. Toxic chemicals are not allowed. Materials that we have lapped:
- glass, sapphire, fused silica, etc.
- metals films
- semiconductors and dielectric
- geological samples
- III-V compounds
- Semiconductors
- Thinning commercial devices to each internal layers, etc.
- Planarize wafers
- thin wafers
The Logitech PM5 Lapper is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
LNF provides alumina slurry in a variety of grits, chemlox polishing and colloidal silica slurry. If you need to use a different slurry please create a helpdesk ticket. The main restriction in the tool is the size of the sample : It must fit within a 100mm circle and can't be thicker than 1 cm. It should, also be suitable for polishing, it should not fall apart while processing. The shape is not a factor, but in order to polish it must be mounted on a glass disc carrier. We, mostly polish wafers, but users have polished minerals, rocks, bones, edge of glass slides, etc.
Standard operating procedure
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Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training.
- It is important to check with the tool engineer for materials compatibility
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
Polishing plate and chuck flatness is checked regularly.
