Logitech PM5 Lapper

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Logitech PM5 Lapper
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Logitech PM5 Lapper
Equipment Details
Technology Polishing
Materials Restriction Metals
Sample Size maximum wafer size 4", maximum sample thickness 10mm
Chemicals Used Polishing slurries
Equipment Manual
Overview System Overview
Operating Procedure SOP
Maintenance Maintenance


The Logitech PM5 Lapper is a polishing and lapping tool that can deliver extremely flat surfaces with integral abrasive auto feed system and integral vacuum system. The PM5 provides an extremely precise, versatile lapping and polishing capability for the research environment. The PM5 is exhausted making it suitable to lap/polish a great variety of materials including III-V semiconductors, geological samples and other environmentally sensitive materials.

Announcements

  • Update this with announcements as necessary

Capabilities

The PM5 Lapping and Polishing system is a bench-top, R&D-scale machine. The highly flexible PM5 can be used with many different materials, including compound semiconductors, silicon, glass, quartz, metals and geological samples. Designed as a single workstation machine, the PM5 has an integral abrasive auto feed system. Available platens allow for polishing/lapping of both soft and hard materials, as well as 4" wafers, 3" wafers and odd shaped samples as large as 4", as long as they can be mounted on the carrier disc.

Materials that we have lapped:

  • glass, sapphire, fused silica, etc.
  • metals films
  • semiconductors and dielectric
  • geological samples
  • III-V compounds
  • Semiconductors

System overview

The Logitech PM5 Lapping and Polishing system is a versatile tool that is suitable for polishing (including chemical mechanical polishing) and lapping of a variety of materials and sample sizes. The Logitech PM5 allows the use of different abrasives and different polishing plates to accommodate materials with varying hardness and chemical properties. The most common slurry used is alumina in different grit sizes, but the tool also allows the use of chemically active slurries. Samples of many sizes and shapes can be polished as long as they are mounted on 3" or 4” glass carriers (available in the LNF store). The 100 mm glass carriers can be transferred into the chuck of the (CMP) polisher, allowing the transfer of samples between these tools. Samples must be mounted prior to polishing, LNF offers a home designed mounting press for this purpose, it is recommended the mounting is done in advanced.

Hardware details

  • Cast iron platten: grooved and non-grooved
  • Glass platten: grooved and non-grooved
  • Stainless steel polishing platten
  • Aluminum polishing platten
  • 4" chuck: PP6
  • 3" Chuck: PP5
  • CMP slurry delivering system
    • Dedicated slurry cylinders for process solution auto feed
    • Chemicals: alumina (20μm, 9μm, 3μm, 1μm, 0.30μm); SF1 colloidal silica

LNF has a home designed mounting press to help users with sample preparation.

Substrate requirements

  • Wafer Size: 3", 4", and pieces provided they can be mounted on a 3" or 4" diameter glass carrier
  • Wafer type: any (waste is collected, hazardous materials can be processed here)
  • Smaller pieces or thin wafers must be mounted

The main restriction is the height of the mounted sample, which must not exceed 7 mm

Material restrictions

When using corrosive slurries, proper platen and slurry cylinder must be used. Toxic chemicals are not allowed. Materials that we have lapped:

  • glass, sapphire, fused silica, etc.
  • metals films
  • semiconductors and dielectric
  • geological samples
  • III-V compounds
  • Semiconductors
  • Thinning commercial devices to each internal layers, etc.

The Logitech PM5 Lapper is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

LNF provides alumina slurry in a variety of grits, chemlox polishing and colloidal silica slurry. If you need to use a different slurry please create a helpdesk ticket. The main restriction in the tool is the size of the sample : It must fit within a 100mm circle and can't be thicker than 1 cm. It should, also be suitable for polishing, it should not fall apart while processing. The shape is not a factor, but in order to polish it must be mounted on a glass disc carrier. It is mostly used to polish wafers, but users have polished minerals, rocks, bones, edge of glass slides, etc.

Standard operating procedure

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Training and checkout procedure

  1. Discuss with the tool engineer about the process
  2. Read through this page and the Standard Operating Procedure above.
  3. Create a Helpdesk Ticket requesting training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Maintenance is mostly controlled by usage. Feed back from users is appreciated

  • Polishing plate and chuck flatness are checked regularly.
  • Slurry cylinder are cleaned disassembled and cleaned regularly list item