MA-BA-6 Mask-Bond Aligner

MA-BA-6 Mask-Bond Aligner
Equipment Details
Technology	Contact lithography
Materials Restriction	Semi-Clean
Material Processed	Photoresist
Mask Materials	4", 5", 7" mask plates
Sample Size	4" and 6" wafers. Pieces with staff approval
Chemicals Used	LNF approved photoresists
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
Maintenance	Maintenance

This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB-6E Bonder.

Capabilities

• 2 µm min feature size resolution in thin resist
• Aspect Ratio 1:3 fairly standard
• Substrate thickness 200 µm to 4 mm possible
• Capable of back side alignment

System overview

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Hardware Details

• Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
• 4" and 6" chucks
  • Backside alignment piece chuck available with staff permission.
• 4", 5" and 7" mask holders
• Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
• Capable of topside, backside and wafer to wafer alignment
• 10 mm stage travel, 150 mm microscope objective travel with split field view camera option

Substrate requirements

• Full 4" and 6" wafers standard
  • Pieces possible with tool engineer approval
• Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
• Substrate thickness 200 µm to 4 mm possible

Material restrictions

The MA-BA-6 Mask-Bond Aligner is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with 3% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB6-E.

Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure. More data on exposure times can be found on datasheet for the specific photoresist.

Standard operating procedure

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Checkout procedure

1. Read through this page and the Standard Operating Procedure above.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is 20 mJ/sec at the 405 nm wavelength with an additional 9-10 mJ/sec at the 365 nm wavelength (the 365 nm peak is not calibrated, but is constant in relation to the 405 nm peak). Lamp uniformity is routinely calibrated to within 2-3% across the 150 mm range. The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked monthly and adjusted as needed for level.