Difference between revisions of "MA-BA-6 Mask-Bond Aligner"

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<!-- Set the resource ID, 5 digit # found on the scheduler -->
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{{DISPLAYTITLE:MA/BA-6 Mask/Bond Aligner}} {{#vardefine:toolid|50020}}{{#vardefine:technology|Contact lithography}} {{#vardefine:restriction|2}}
{{#vardefine:toolid|50020}}
 
<!-- Set the Process Technology (see subcategories on Equipment page) -->
 
{{#vardefine:technology|Contact Lithography}}
 
<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
 
{{#vardefine:restriction|2}}
 
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
|materials =  
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|materials = [[Photoresist]]
|mask =4", 5", 7"
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|mask =4", 5", 7" mask plates
|size = 4" and 6" wafers.  Pieces with staff approval
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|size = 4" and 6" wafers
|chemicals = lnf approved photoresists
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|chemicals = LNF approved photoresists
|gases =
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|overview = [https://drive.google.com/file/d/0B3k-qgz56T_4b2duZlYzSFNaNmc/view?usp=sharing&resourcekey=0-0fSam_yon_Y7uCxykeXDpA System Overview]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
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|sop = [https://drive.google.com/file/d/0B3k-qgz56T_4a0JrTjR5N004d2s/view?usp=sharing&resourcekey=0-zjzn27ZsmH7-CnhV664jCw Topside Mask Alignment SOP]
|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1fqWwTY2zI1o1NFhlDWI0ZVJ0lsMnCfwpj1QXhZApKyc/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
 
}}
 
}}
  
{{warning|This page has not been released yet.}}
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This tool is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.  This tool is capable of backside alignment.  The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]].  
 
 
This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.  The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]].  
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* 1-2 µm min feature size resolution in thin resist
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* 2 µm min feature size resolution in thin resist
 
* Aspect Ratio 1:3 fairly standard
 
* Aspect Ratio 1:3 fairly standard
 
* Substrate thickness 200 µm to 4 mm possible
 
* Substrate thickness 200 µm to 4 mm possible
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* Capable of back side alignment
  
==System Overview==
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==System overview==
{{#widget:GoogleDoc|key=1lv9Fn5spwDrptJDpjkIkggPPx6GujKKS-S9dmdsItRw}}
 
 
===Hardware Details===
 
===Hardware Details===
* Broadband light source calibrated to 20mJ/sec at the 405nm peak.  Total broadband dose about 30mJ/sec
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* Broadband light source calibrated to 20 mJ/sec at the 405 nm peak.  Total broadband dose ~30 mJ/sec
 
* 4" and 6" chucks
 
* 4" and 6" chucks
 
** Backside alignment piece chuck available with staff permission.
 
** Backside alignment piece chuck available with staff permission.
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* Flood exposure, soft, hard, and vacuum contact capable
 
* Flood exposure, soft, hard, and vacuum contact capable
 
* Capable of topside, backside and wafer to wafer alignment
 
* Capable of topside, backside and wafer to wafer alignment
* 10mm stage travel, 150mm microscope objective travel with split field view camera option
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* 10 mm stage travel, 150 mm microscope objective travel with split field view camera option
  
===Substrate Requirements===
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===Substrate requirements===
* Full 4" and 6" wafers standard
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* Full 4" and 6" wafers standard (pieces should use the [[MJB3-2|MJB3]] with a 4" mask)
** Pieces possible with tool engineer approval
 
 
* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
 
* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
 
* Substrate thickness 200 µm to 4 mm possible
 
* Substrate thickness 200 µm to 4 mm possible
  
===Material Restrictions===
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===Material restrictions===
{{material restrictions}}
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Allowed Materials - LNF approved photoresists
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Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
  
==Supported Processes==  
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==Supported processes==  
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
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This tool is primarily used to expose photodefinable materials.  The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure. 
  
Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure.
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Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page, such as [[SPR 955]]
  
==Standard Operating Procedure==
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==Standard operating procedure==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
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* [https://drive.google.com/file/d/0B3k-qgz56T_4b2duZlYzSFNaNmc/view?usp=sharing&resourcekey=0-0fSam_yon_Y7uCxykeXDpA System Overview]
{{#widget:GoogleDoc|key=1osI1dfDu0wWVK-_nKJKM2fK-Pa8_V1Pp7Xcj1WDvtHU}}
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* [https://drive.google.com/file/d/0B3k-qgz56T_4a0JrTjR5N004d2s/view?usp=sharing&resourcekey=0-zjzn27ZsmH7-CnhV664jCw Topside Mask Alignment SOP]
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* [https://drive.google.com/file/d/0B3k-qgz56T_4c1k4dEhvdlZfcnc/view?usp=sharing&resourcekey=0-pJyidlm-pXqJBdOoreSFMw Backside Mask Alignment SOP]
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* For Bond Alignment please make a Helpdesk ticket
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* [https://drive.google.com/file/d/0B3k-qgz56T_4Um5URGdYcl90eXM/view?usp=sharing&resourcekey=0-5nKwkOokCWra5e4sv6w50g Troubleshooting]
  
==Checkout Procedure==
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==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# A tool engineer will schedule a time for initial training.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
==Maintenance==
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# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
<!-- Describe standard maintenance/qualification tests here -->
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# Practice on the tool with your mentor.
̈Lamp uniformity is routinely calibrated to within 2-3 % across the 150 mm range.
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# Read through the User Manual above.
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# Accurately complete the [https://docs.google.com/a/lnf.umich.edu/forms/d/1L5TToo8m1ZaTqTK5p8UJ6gEcPR_8UFawA21pygwi_34/viewform checkout quiz]. You may retake as necessary until all answers are correct.
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# Schedule a time for a checkout:
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## Find an available time for checkout [https://calendly.com/lnf-lithography/contact-aligner-checkout here].
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## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
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## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.

Latest revision as of 18:45, 27 September 2021

MA-BA-6 Mask-Bond Aligner
50020.jpg
Equipment Details
Technology Contact lithography
Materials Restriction Semi-Clean
Material Processed Photoresist
Mask Materials 4", 5", 7" mask plates
Sample Size 4" and 6" wafers
Chemicals Used LNF approved photoresists
Equipment Manual
Overview System Overview
Operating Procedure Topside Mask Alignment SOP


This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB-6E Bonder.

Capabilities

  • 2 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 fairly standard
  • Substrate thickness 200 µm to 4 mm possible
  • Capable of back side alignment

System overview

Hardware Details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose ~30 mJ/sec
  • 4" and 6" chucks
    • Backside alignment piece chuck available with staff permission.
  • 4", 5" and 7" mask holders
  • Flood exposure, soft, hard, and vacuum contact capable
  • Capable of topside, backside and wafer to wafer alignment
  • 10 mm stage travel, 150 mm microscope objective travel with split field view camera option

Substrate requirements

  • Full 4" and 6" wafers standard (pieces should use the MJB3 with a 4" mask)
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness 200 µm to 4 mm possible

Material restrictions

Allowed Materials - LNF approved photoresists

Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)

Supported processes

This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.

Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page, such as SPR 955

Standard operating procedure

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.