Difference between revisions of "MA-BA-6 Mask-Bond Aligner"
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| − | + | {{DISPLAYTITLE:MA/BA-6 Mask/Bond Aligner}} {{#vardefine:toolid|50020}}{{#vardefine:technology|Contact lithography}} {{#vardefine:restriction|2}} | |
| − | {{#vardefine:toolid|50020}} | ||
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| − | {{#vardefine:technology|Contact | ||
| − | |||
| − | {{#vardefine:restriction|2}} | ||
{{infobox equipment | {{infobox equipment | ||
|caption = | |caption = | ||
| − | |materials = | + | |materials = [[Photoresist]] |
| − | |mask =4", 5", 7" | + | |mask =4", 5", 7" mask plates |
| − | |size = 4" and 6" wafers | + | |size = 4" and 6" wafers |
| − | |chemicals = | + | |chemicals = LNF approved photoresists |
| − | + | |overview = [https://drive.google.com/file/d/0B3k-qgz56T_4b2duZlYzSFNaNmc/view?usp=sharing&resourcekey=0-0fSam_yon_Y7uCxykeXDpA System Overview] | |
| − | |overview = [ | + | |sop = [https://drive.google.com/file/d/0B3k-qgz56T_4a0JrTjR5N004d2s/view?usp=sharing&resourcekey=0-zjzn27ZsmH7-CnhV664jCw Topside Mask Alignment SOP] |
| − | |sop = [https:// | ||
| − | |||
| − | |||
}} | }} | ||
| − | + | This tool is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]]. | |
| − | |||
| − | This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]]. | ||
==Capabilities== | ==Capabilities== | ||
<!--A more general description of what the tool is capable of doing.--> | <!--A more general description of what the tool is capable of doing.--> | ||
| − | * | + | * 2 µm min feature size resolution in thin resist |
* Aspect Ratio 1:3 fairly standard | * Aspect Ratio 1:3 fairly standard | ||
* Substrate thickness 200 µm to 4 mm possible | * Substrate thickness 200 µm to 4 mm possible | ||
| + | * Capable of back side alignment | ||
| − | ==System | + | ==System overview== |
| − | |||
===Hardware Details=== | ===Hardware Details=== | ||
| − | * Broadband light source calibrated to | + | * Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose ~30 mJ/sec |
* 4" and 6" chucks | * 4" and 6" chucks | ||
** Backside alignment piece chuck available with staff permission. | ** Backside alignment piece chuck available with staff permission. | ||
| Line 37: | Line 27: | ||
* Flood exposure, soft, hard, and vacuum contact capable | * Flood exposure, soft, hard, and vacuum contact capable | ||
* Capable of topside, backside and wafer to wafer alignment | * Capable of topside, backside and wafer to wafer alignment | ||
| − | * | + | * 10 mm stage travel, 150 mm microscope objective travel with split field view camera option |
| − | ===Substrate | + | ===Substrate requirements=== |
| − | * Full 4" and 6" wafers standard | + | * Full 4" and 6" wafers standard (pieces should use the [[MJB3-2|MJB3]] with a 4" mask) |
| − | |||
* Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance | * Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance | ||
* Substrate thickness 200 µm to 4 mm possible | * Substrate thickness 200 µm to 4 mm possible | ||
| − | ===Material | + | ===Material restrictions=== |
| − | + | Allowed Materials - LNF approved photoresists | |
| + | |||
| + | Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval) | ||
| − | ==Supported | + | ==Supported processes== |
| − | < | + | This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure. |
| − | Exposure of all LNF approved photoresists are allowed on this tool | + | Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page, such as [[SPR 955]] |
| − | ==Standard | + | ==Standard operating procedure== |
| − | + | * [https://drive.google.com/file/d/0B3k-qgz56T_4b2duZlYzSFNaNmc/view?usp=sharing&resourcekey=0-0fSam_yon_Y7uCxykeXDpA System Overview] | |
| − | + | * [https://drive.google.com/file/d/0B3k-qgz56T_4a0JrTjR5N004d2s/view?usp=sharing&resourcekey=0-zjzn27ZsmH7-CnhV664jCw Topside Mask Alignment SOP] | |
| + | * [https://drive.google.com/file/d/0B3k-qgz56T_4c1k4dEhvdlZfcnc/view?usp=sharing&resourcekey=0-pJyidlm-pXqJBdOoreSFMw Backside Mask Alignment SOP] | ||
| + | * For Bond Alignment please make a Helpdesk ticket | ||
| + | * [https://drive.google.com/file/d/0B3k-qgz56T_4Um5URGdYcl90eXM/view?usp=sharing&resourcekey=0-5nKwkOokCWra5e4sv6w50g Troubleshooting] | ||
| − | ==Checkout | + | ==Checkout procedure== |
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | + | # Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again. | |
| − | + | # Practice on the tool with your mentor. | |
| − | + | # Read through the User Manual above. | |
| + | # Accurately complete the [https://docs.google.com/a/lnf.umich.edu/forms/d/1L5TToo8m1ZaTqTK5p8UJ6gEcPR_8UFawA21pygwi_34/viewform checkout quiz]. You may retake as necessary until all answers are correct. | ||
| + | # Schedule a time for a checkout: | ||
| + | ## Find an available time for checkout [https://calendly.com/lnf-lithography/contact-aligner-checkout here]. | ||
| + | ## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting. | ||
| + | ## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time. | ||
| + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment. | ||
| + | # Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer. | ||
Revision as of 17:45, 27 September 2021
| MA-BA-6 Mask-Bond Aligner | |
|---|---|
 | |
| Equipment Details | |
| Technology | Contact lithography |
| Materials Restriction | Semi-Clean |
| Material Processed | Photoresist |
| Mask Materials | 4", 5", 7" mask plates |
| Sample Size | 4" and 6" wafers |
| Chemicals Used | LNF approved photoresists |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | Topside Mask Alignment SOP |
This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB-6E Bonder.
Contents
Capabilities
- 2 µm min feature size resolution in thin resist
- Aspect Ratio 1:3 fairly standard
- Substrate thickness 200 µm to 4 mm possible
- Capable of back side alignment
System overview
Hardware Details
- Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose ~30 mJ/sec
- 4" and 6" chucks
- Backside alignment piece chuck available with staff permission.
- 4", 5" and 7" mask holders
- Flood exposure, soft, hard, and vacuum contact capable
- Capable of topside, backside and wafer to wafer alignment
- 10 mm stage travel, 150 mm microscope objective travel with split field view camera option
Substrate requirements
- Full 4" and 6" wafers standard (pieces should use the MJB3 with a 4" mask)
- Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
- Substrate thickness 200 µm to 4 mm possible
Material restrictions
Allowed Materials - LNF approved photoresists
Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
Supported processes
This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.
Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page, such as SPR 955
Standard operating procedure
- System Overview
- Topside Mask Alignment SOP
- Backside Mask Alignment SOP
- For Bond Alignment please make a Helpdesk ticket
- Troubleshooting
Checkout procedure
- Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
- Practice on the tool with your mentor.
- Read through the User Manual above.
- Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
- Schedule a time for a checkout:
- Find an available time for checkout here.
- Verify that the tool is available in the LNF Online Services at the time you are requesting.
- After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
- Create a helpdesk ticket for final confirmation of your checkout appointment.
- Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
