Difference between revisions of "MA-BA-6 Mask-Bond Aligner"

From LNF Wiki
Jump to navigation Jump to search
(Created page with "<!-- Set the resource ID, 5 digit # found on the scheduler --> {{#vardefine:toolid|50020}} <!-- Set the Process Technology (see subcategories on Equipment page) --> {{#vardefi...")
 
Line 60: Line 60:
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
+
{{#widget:GoogleDoc|key=1fqWwTY2zI1o1NFhlDWI0ZVJ0lsMnCfwpj1QXhZApKyc}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==

Revision as of 10:25, 21 April 2015



MA-BA-6 Mask-Bond Aligner
50020.jpg
Equipment Details
Technology Contact Lithography
Materials Restriction Undefined
Mask Materials 4", 5", 7"
Sample Size 4" and 6" wafers. Pieces with staff approval
Chemicals Used lnf approved photoresists
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB6-e.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Etch Rate
  • Resolution
  • Aspect Ratio
  • Thickness range

System Overview

Hardware Details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate Requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material Restrictions

The MA-BA-6 Mask-Bond Aligner is designated as a Undefined class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on MA-BA-6 Mask-Bond Aligner User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Tool Qualification

Process Name