MA-BA-6 Mask-Bond Aligner

MA-BA-6 Mask-Bond Aligner
Equipment Details
Technology	Contact lithography
Materials Restriction	Semi-Clean
Material Processed	Photoresist
Mask Materials	4", 5", 7" mask plates
Sample Size	4" and 6" wafers
Chemicals Used	LNF approved photoresists
Equipment Manual
Overview	System Overview
Operating Procedure	Topside Mask Alignment SOP

This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB-6E Bonder.

Capabilities

• 2 µm min feature size resolution in thin resist
• Aspect Ratio 1:3 fairly standard
• Substrate thickness 200 µm to 4 mm possible
• Capable of back side alignment

System overview

Hardware Details

• Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose ~30 mJ/sec
• 4" and 6" chucks
  • Backside alignment piece chuck available with staff permission.
• 4", 5" and 7" mask holders
• Flood exposure, soft, hard, and vacuum contact capable
• Capable of topside, backside and wafer to wafer alignment
• 10 mm stage travel, 150 mm microscope objective travel with split field view camera option

Substrate requirements

• Full 4" and 6" wafers standard (pieces should use the MJB3 with a 4" mask)
• Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
• Substrate thickness 200 µm to 4 mm possible

Material restrictions

Allowed Materials - LNF approved photoresists

Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)

Supported processes

This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.

Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page, such as SPR 955

Standard operating procedure

• System Overview
• Topside Mask Alignment SOP
• Backside Mask Alignment SOP
• For Bond Alignment please make a Helpdesk ticket
• Troubleshooting

Checkout procedure

1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
2. Read through the Standard Operating Procedure.
3. Practice with your mentor or another authorized user until you are comfortable with tool operation.
4. Complete the SOP quiz
5. Create a Helpdesk Ticket requesting training.
6. A tool engineer will schedule a time for initial training.
7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.