Difference between revisions of "MA6 Mask Aligner"

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--> {{#vardefine:technology|Contact Lithography}} <!--
 
--> {{#vardefine:technology|Contact Lithography}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
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--> {{#vardefine:restriction|3}}
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--> {{#vardefine:restriction|2}}
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
 
|materials = [[Photoresist]]
 
|materials = [[Photoresist]]
 
|mask =4", 5", 7" mask plates
 
|mask =4", 5", 7" mask plates
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|size = 4" and 6" wafers.  Pieces with staff approval
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|size = 4" and 6" wafers
 
|chemicals = LNF approved photoresists
 
|chemicals = LNF approved photoresists
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|gases =
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|overview = [https://drive.google.com/file/d/0B3k-qgz56T_4YWJLc2t3ZUJQZ2s/view?usp=sharing&resourcekey=0-54OMu8wX_SgVg3lwk8zSmQ System Overview ]
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|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
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|sop = [https://drive.google.com/file/d/0B3k-qgz56T_4WXo4VFVnWjI4R0k/view?usp=sharing&resourcekey=0-A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]
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|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1fqWwTY2zI1o1NFhlDWI0ZVJ0lsMnCfwpj1QXhZApKyc/preview SOP]
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|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
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|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
 
}}
 
}}
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The [[{{PAGENAME}}]] is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.  
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This tool is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.  
 
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
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* 1-2 µm min feature size resolution in thin resist
+
* 2 µm min feature size resolution in thin resist
 
* Aspect Ratio 1:3 fairly standard
 
* Aspect Ratio 1:3 fairly standard
 
* Substrate thickness 200 µm to 4 mm possible
 
* Substrate thickness 200 µm to 4 mm possible
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−
==Announcements==
 
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*Update this with announcements as necessary
 
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==Capabilities==
 
−
<!--A more general description of what the tool is capable of doing.-->
 
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* Etch Rate
 
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* Resolution
 
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* Aspect Ratio
 
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* Thickness range
 
  
 
==System overview==
 
==System overview==
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===Hardware details===
+
===Hardware Details===
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* Gases
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* Broadband light source calibrated to 20 mJ/sec at the 405 nm peak.  Total broadband dose about 30 mJ/sec
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* Pressure
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* 4" and 6" chucks
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* Chuck
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* 4", 5" and 7" mask holders
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* Chamber
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* Flood exposure, soft, hard, and vacuum contact capable
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* RF / Power Specs
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* Topside alignment (no backside or bond alignment)
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* Chemicals
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* 10 mm stage travel, 150 mm microscope objective travel with split field view camera option
  
 
===Substrate requirements===
 
===Substrate requirements===
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* Wafer Size
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* Full 4" and 6" wafers standard
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* Wafer type
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* Pieces are not allowed in this mask aligner. For pieces use MJB3 instead
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* Any mounting?
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* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
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* Wafer thickness
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* Substrate thickness 200 µm to 4 mm possible
  
 
===Material restrictions===
 
===Material restrictions===
−
{{material restrictions}}
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Allowed Materials - LNF approved photoresists
 +
 
 +
Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
  
 
==Supported processes==  
 
==Supported processes==  
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<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
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This tool is primarily used to expose photodefinable materials.  The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure. 
  
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There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
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Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page.
−
 
 
−
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
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In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
  
 
==Standard operating procedure==
 
==Standard operating procedure==
−
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
+
* [https://drive.google.com/file/d/0B3k-qgz56T_4YWJLc2t3ZUJQZ2s/view?usp=sharing&resourcekey=0-54OMu8wX_SgVg3lwk8zSmQ System Overview ]
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{{#widget:GoogleDoc|key=googledocid}}
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* [https://drive.google.com/file/d/0B3k-qgz56T_4WXo4VFVnWjI4R0k/view?usp=sharing&resourcekey=0-A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]
 +
* [https://drive.google.com/file/d/0B3k-qgz56T_4dTk2NlRQalNmMUk/view?usp=sharing&resourcekey=0-hq5tzpfZ3eoziMnhobUb2w Troubleshooting]
  
 
==Checkout procedure==
 
==Checkout procedure==
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<!-- Describe the checkout procedure for the tool. For example: -->
 
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# Read through this page and the Standard Operating Procedure above.
 
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# Complete the training request form [http://examplelink.com here].
 
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
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# A tool engineer will schedule a time for initial training.
 
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# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
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# Complete the SOP quiz [http://examplelink.com here].
 
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# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
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==Maintenance==
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# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
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<!-- Describe standard maintenance/qualification tests here -->
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# Practice on the tool with your mentor.
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# Read through the User Manual above.
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===Process name===
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# Accurately complete the [https://docs.google.com/a/lnf.umich.edu/forms/d/1L5TToo8m1ZaTqTK5p8UJ6gEcPR_8UFawA21pygwi_34/viewform checkout quiz]. You may retake as necessary until all answers are correct.
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<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
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# Schedule a time for a checkout:
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{{#widget:Iframe
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## Find an available time for checkout [https://calendly.com/lnf-lithography/contact-aligner-checkout here].
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|url=chart url
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## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
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|width=800
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## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
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|height=400
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
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|border=0
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# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
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}}
 

Revision as of 10:51, 28 September 2021

MA6 Mask Aligner
50101.jpg
Equipment Details
Technology Contact Lithography
Materials Restriction Semi-Clean
Material Processed Photoresist
Mask Materials 4", 5", 7" mask plates
Sample Size 4" and 6" wafers
Chemicals Used LNF approved photoresists
Equipment Manual
Overview System Overview
Operating Procedure Topside Mask Alignment SOP


The MA6 Mask Aligner is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.

Capabilities

  • 2 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 fairly standard
  • Substrate thickness 200 µm to 4 mm possible

System overview

Hardware Details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
  • 4" and 6" chucks
  • 4", 5" and 7" mask holders
  • Flood exposure, soft, hard, and vacuum contact capable
  • Topside alignment (no backside or bond alignment)
  • 10 mm stage travel, 150 mm microscope objective travel with split field view camera option

Substrate requirements

  • Full 4" and 6" wafers standard
  • Pieces are not allowed in this mask aligner. For pieces use MJB3 instead
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness 200 µm to 4 mm possible

Material restrictions

Allowed Materials - LNF approved photoresists

Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)

Supported processes

This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.

Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page.

Standard operating procedure

Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Practice on the tool with your mentor.
  3. Read through the User Manual above.
  4. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  5. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  6. Create a helpdesk ticket for final confirmation of your checkout appointment.
  7. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
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