Difference between revisions of "MA6 Mask Aligner"
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|caption = | |caption = | ||
| − | |materials = | + | |materials = [[Photoresist]] |
| − | |mask = | + | |mask =4", 5", 7" mask plates |
| − | |size = | + | |size = 4" and 6" wafers. Pieces with staff approval |
| − | |chemicals = | + | |chemicals = LNF approved photoresists |
| − | |gases = | + | |gases = |
| − | |overview = [[{{PAGENAME}}# | + | |overview = [[{{PAGENAME}}#System_Overview | System Overview]] |
| − | |sop = [https:// | + | |sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1fqWwTY2zI1o1NFhlDWI0ZVJ0lsMnCfwpj1QXhZApKyc/preview SOP] |
|processes = [[{{PAGENAME}}/Processes|Supported Processes]] | |processes = [[{{PAGENAME}}/Processes|Supported Processes]] | ||
| − | |||
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | |maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]] | ||
}} | }} | ||
| − | + | This tool is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]]. | |
| − | |||
| − | |||
| + | ==Capabilities== | ||
| + | <!--A more general description of what the tool is capable of doing.--> | ||
| + | * 1-2 µm min feature size resolution in thin resist | ||
| + | * Aspect Ratio 1:3 fairly standard | ||
| + | * Substrate thickness 200 µm to 4 mm possible | ||
| + | * Capable of back side alignment | ||
| + | |||
==Announcements== | ==Announcements== | ||
*Update this with announcements as necessary | *Update this with announcements as necessary | ||
Revision as of 12:25, 10 August 2015
| MA6 Mask Aligner | |
|---|---|
 | |
| Equipment Details | |
| Technology | Contact Lithography |
| Materials Restriction | Metals |
| Material Processed | Photoresist |
| Mask Materials | 4", 5", 7" mask plates |
| Sample Size | 4" and 6" wafers. Pieces with staff approval |
| Chemicals Used | LNF approved photoresists |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| Maintenance | Maintenance |
This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the SB-6E Bonder.
Contents
Capabilities
- 1-2 µm min feature size resolution in thin resist
- Aspect Ratio 1:3 fairly standard
- Substrate thickness 200 µm to 4 mm possible
- Capable of back side alignment
Announcements
- Update this with announcements as necessary
Capabilities
- Etch Rate
- Resolution
- Aspect Ratio
- Thickness range
System overview
Hardware details
- Gases
- Pressure
- Chuck
- Chamber
- RF / Power Specs
- Chemicals
Substrate requirements
- Wafer Size
- Wafer type
- Any mounting?
- Wafer thickness
Material restrictions
The MA6 Mask Aligner is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on MA6 Mask Aligner user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Complete the training request form here.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the SOP quiz here.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
Process name
