Difference between revisions of "MA6 Mask Aligner"
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==Standard operating procedure== | ==Standard operating procedure== | ||
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==Checkout procedure== | ==Checkout procedure== | ||
Revision as of 14:25, 23 August 2015
| MA6 Mask Aligner | |
|---|---|
 | |
| Equipment Details | |
| Technology | Contact Lithography |
| Materials Restriction | Semi-Clean |
| Material Processed | Photoresist |
| Mask Materials | 4", 5", 7" mask plates |
| Sample Size | 4" and 6" wafers. Pieces with staff approval |
| Chemicals Used | LNF approved photoresists |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| Maintenance | Maintenance |
This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.
Contents
Capabilities
- 1-2 µm min feature size resolution in thin resist
- Aspect Ratio 1:3 fairly standard
- Substrate thickness 200 µm to 4 mm possible
Announcements
- Update this with announcements as necessary
System overview
Hardware Details
- Broadband light source calibrated to 20mJ/sec at the 405nm peak. Total broadband dose about 30mJ/sec
- 4" and 6" chucks
- 4", 5" and 7" mask holders
- Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
- Capable of topside alignment only
- 10mm stage travel, 150mm microscope objective travel with split field view camera option
Substrate requirements
- Full 4" and 6" wafers standard
- Pieces possible with tool engineer approval
- Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
- Substrate thickness 200 µm to 4 mm possible
Material restrictions
The MA6 Mask Aligner is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on MA6 Mask Aligner user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
Widget text will go here.
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Complete the training request form here.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the SOP quiz here.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
Process name
