Difference between revisions of "MA6 Mask Aligner"

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* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
* Substrate thickness 200 µm to 4 mm possible
* Substrate thickness 200 µm to 4 mm possible
===Material restrictions===
===Material restrictions===

Revision as of 15:13, 23 August 2015

MA6 Mask Aligner
Equipment Details
Technology Contact Lithography
Materials Restriction Semi-Clean
Material Processed Photoresist
Mask Materials 4", 5", 7" mask plates
Sample Size 4" and 6" wafers. Pieces with staff approval
Chemicals Used LNF approved photoresists
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance

This tool is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.


  • 1-2 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 fairly standard
  • Substrate thickness 200 µm to 4 mm possible


  • Update this with announcements as necessary

System overview

Hardware Details

  • Broadband light source calibrated to 20mJ/sec at the 405nm peak. Total broadband dose about 30mJ/sec
  • 4" and 6" chucks
  • 4", 5" and 7" mask holders
  • Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
  • Capable of topside alignment only
  • 10mm stage travel, 150mm microscope objective travel with split field view camera option

Substrate requirements

  • Full 4" and 6" wafers standard
    • Pieces possible with tool engineer approval
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness 200 µm to 4 mm possible

Material restrictions

The MA6 Mask Aligner is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on MA6 Mask Aligner user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.


The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is 20 mJ/sec at the 405 nm wavelength with an additional 9-10 mJ/sec at the 365 nm wavelength (the 365 nm peak is not calibrated, but is constant in relation to the 405 nm peak). Lamp uniformity is routinely calibrated to within 2-3% across the 150 mm range. The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked monthly and adjusted as needed for level.

Process name