MA6 Mask Aligner
| MA6 Mask Aligner | |
|---|---|
 | |
| Equipment Details | |
| Technology | Contact Lithography |
| Materials Restriction | Semi-Clean |
| Material Processed | Photoresist |
| Mask Materials | 4", 5", 7" mask plates |
| Sample Size | 4" and 6" wafers |
| Chemicals Used | LNF approved photoresists |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | Topside Mask Alignment SOP |
The MA6 Mask Aligner is primarily used to expose photo-definable materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.
Contents
Capabilities
- 2 µm min feature size resolution in thin resist
- Aspect Ratio 1:3 fairly standard
- Substrate thickness 200 µm to 4 mm possible
System overview
Hardware Details
- Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
- 4" and 6" chucks
- 4", 5" and 7" mask holders
- Flood exposure, soft, hard, and vacuum contact capable
- Topside alignment (no backside or bond alignment)
- 10 mm stage travel, 150 mm microscope objective travel with split field view camera option
Substrate requirements
- Full 4" and 6" wafers standard (pieces are not allowed in this mask aligner. For pieces use MJB3 instead)
- Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
- Substrate thickness 200 µm to 4 mm possible
Material restrictions
Allowed Materials - LNF approved photoresists
Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
Supported processes
This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <5% uniformity across the 4” area. The 365 peak output is about half of this and tracks very well however is not routinely calibrated. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or a manually timed flood exposure.
Exposure of all LNF approved photoresists are allowed on this tool, for data on specific resist please see that resists wiki page.
Standard operating procedure
Checkout procedure
- Read through this page and the Standard Operating Procedure above.
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
