View source for MJB3-2

{{#vardefine:toolid|50041}} {{#vardefine:technology|Contact lithography}} {{#vardefine:restriction|4}}
{{infobox equipment
|caption = 
|materials = LNF approved [[photoresist]]s
|mask = 4" masks (smaller possible with tool engineer discussion)
|size = small pieces up to 3" diameter
|chemicals =
|gases = 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://docs.google.com/document/d/1fhmJ5T8mw2RLVgUgm0u2W7FXRHD73Srh/edit?usp=sharing&ouid=109740028282576410484&rtpof=true&sd=true SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
}}

The [[{{PAGENAME}}]] is primarily used to expose [[Photoresist|photo-definable]] materials on small pieces up to 3" in diameter. It only accepts 4” hard masks or smaller. Transparencies, shadow masks, or flood exposure can also be used.

==Capabilities==
<!--A more general description of what the tool is capable of doing.-->
* 4-5 µm min feature size resolution in thin resist
* Aspect Ratio 1:3 possible
* Substrate thickness 200 µm to 4 mm possible

==System overview==
===Hardware details===
* Broadband light source calibrated to 20 mJ/sec at the 405 nm peak.  Total broadband dose about 30 mJ/sec
* piece chucks and 3" chuck
* 3", and 4" mask holder
* Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
* Capable of topside alignment only
* 10 mm stage travel, 75 mm microscope objective travel

===Substrate requirements===
* Full 3" and wafer pieces standard
* Mounting may be necessary if wafer has thru holes, etc.  Create helpdesk ticket for assistance
* Substrate thickness 200 µm to 4 mm possible
** Thicker substrates or [[PDMS]] may be used with tool engineer approval

===Material restrictions===
{{cleanup-materials}}
{{material restrictions}}

==Supported processes== 

Please get staff assistance through the [[lithography training session]] or [[lithography handbook]], or see material datasheets for your [[photoresist]].

==Standard operating procedure==
[https://docs.google.com/document/d/1fhmJ5T8mw2RLVgUgm0u2W7FXRHD73Srh/edit?usp=sharing&ouid=109740028282576410484&rtpof=true&sd=true SOP]

==Checkout procedure==

# Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.
# Practice on the tool with your mentor.
# Read through the User Manual above.
# Accurately complete the [https://docs.google.com/forms/d/e/1FAIpQLSfe7DBZ8Ldr8YxAGrgXpb-UVv8__o9ijhKKV5D6XxVyupvMcw/viewform?usp=sf_link checkout quiz]. You may retake as necessary until all answers are correct.
# Schedule a time for a checkout:
## Find an available time for checkout [https://calendly.com/lnf-lithography/contact-aligner-checkout here].
## Verify that the tool is available in the [https://ssel-sched.eecs.umich.edu/sselscheduler/ResourceDayWeek.aspx?Path=0-0-0-{{#var:toolid}} LNF Online Services] at the time you are requesting.
## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.
# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.

==Maintenance== 
The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is 20 mJ/sec at the 405 nm wavelength with an additional 9-10 mJ/sec at the 365 nm wavelength (the 365 nm peak is not calibrated, but is constant in relation to the 405 nm peak). Lamp uniformity is routinely calibrated to within 2-3% across the 75 mm range.
The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked weekly and adjusted as needed for proper height and level.