Difference between revisions of "MJB3-2"

From LNF Wiki
Jump to navigation Jump to search
Line 60: Line 60:
 
==Checkout procedure==
 
==Checkout procedure==
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
+
# Read through this page and the [https://docs.google.com/document/d/1cYUPWWE7AzkE-BRLHFfqDQG_HmtavqVICj8G6QGENdE/preview Standard Operating Procedure] above.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 +
# Complete the SOP quiz [https://docs.google.com/forms/d/e/1FAIpQLSfe7DBZ8Ldr8YxAGrgXpb-UVv8__o9ijhKKV5D6XxVyupvMcw/viewform?usp=sf_link here]
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# A tool engineer will schedule a time for initial training.
 
# A tool engineer will schedule a time for initial training.

Revision as of 15:51, 29 January 2018

MJB3-2
50041.jpg
Equipment Details
Technology Contact lithography
Materials Restriction Metals
Material Processed LNF approved photoresists
Mask Materials 4" masks (smaller possible with tool engineer discussion)
Sample Size small pieces up to 3" diameter
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The MJB3-2 is primarily used to expose photo-definable materials on small pieces up to 3" in diameter. It only accepts 4” hard masks or smaller. Transparencies, shadow masks, or flood exposure can also be used.

Announcements

  • Update this with announcements as necessary

Capabilities

  • 4-5 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 possible
  • Substrate thickness 200 µm to 4 mm possible

System overview

Hardware details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
  • piece chucks and 3" chuck
  • 3", and 4" mask holder
  • Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
  • Capable of topside alignment only
  • 10 mm stage travel, 75 mm microscope objective travel

Substrate requirements

  • Full 3" and wafer pieces standard
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness 200 µm to 4 mm possible
    • Thicker substrates or PDMS may be used with tool engineer approval

Material restrictions

The MJB3-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Please get staff assistance through the lithogrpahy training session or lithopraphy handbook, or see material datasheets for your photoresist.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Complete the SOP quiz here
  4. Create a Helpdesk Ticket requesting training.
  5. A tool engineer will schedule a time for initial training.
  6. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is 20 mJ/sec at the 405 nm wavelength with an additional 9-10 mJ/sec at the 365 nm wavelength (the 365 nm peak is not calibrated, but is constant in relation to the 405 nm peak). Lamp uniformity is routinely calibrated to within 2-3% across the 75 mm range. The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked weekly and adjusted as needed for proper height and level.