Difference between revisions of "MJB3-2"

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==Supported processes==  
==Supported processes==  
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
Please get staff assistance through the lithogrpahy training session or lithopraphy handbook, or see material datasheets for your photoresist.
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
==Standard operating procedure==
==Standard operating procedure==

Revision as of 17:19, 24 August 2015

Equipment Details
Technology Contact lithography
Materials Restriction Metals
Material Processed LNF approved photoresists
Mask Materials 4" masks (smaller possible with tool engineer discussion)
Sample Size small pieces up to 3" diameter
Equipment Manual
Overview System Overview
Operating Procedure [1]
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance

Warning Warning: This page has not been released yet.

This tool is primarily used to expose photo-definable materials on small pieces up to 3" in diameter. It only accepts 4” hard masks or smaller. Transparencies, shadow masks, or flood exposure can also be used.


  • Update this with announcements as necessary


  • 4-5 µm min feature size resolution in thin resist
  • Aspect Ratio 1:3 possible
  • Substrate thickness 200 µm to 4 mm possible

System overview

Hardware details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
  • piece chucks and 3" chuck
  • 3", and 4" mask holder
  • Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
  • Capable of topside alignment only
  • 10 mm stage travel, 75 mm microscope objective travel

Substrate requirements

  • Full 3" and wafer pieces standard
  • Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
  • Substrate thickness 200 µm to 4 mm possible
    • Thicker substrates or PDMS may be used with tool engineer approval

Material restrictions

The MJB3-2 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Please get staff assistance through the lithogrpahy training session or lithopraphy handbook, or see material datasheets for your photoresist.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.


The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is 20 mJ/sec at the 405 nm wavelength with an additional 9-10 mJ/sec at the 365 nm wavelength (the 365 nm peak is not calibrated, but is constant in relation to the 405 nm peak). Lamp uniformity is routinely calibrated to within 2-3% across the 75 mm range. The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked weekly and adjusted as needed for proper height and level.

Process name