Difference between revisions of "MJB 45S"

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==Supported Processes==  
 
==Supported Processes==  
{{expand section|adding links to PR datasheets/pages}}
 
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->Exposure of all LNF approved Photoresists (including SU-8 resists) is permitted in this tool.  Data sheets for specific Photoresists can be found in the Solvent Bench 94 manual.
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->Exposure of all LNF approved Photoresists (including SU-8 resists) is permitted in this tool.  Data sheets for specific Photoresists can be found in the Solvent Bench 94 manual.
  

Revision as of 17:12, 18 October 2021



MJB 45S
50111.jpg
MJB 45S Mask Aligner
Equipment Details
Technology Contact lithography
Materials Restriction Undefined
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The Karl Suss MA 45S is a Contact lithography Tool capable of exposing photosensitive materials on substrates up to 4" diameter and thickness up to 5 mm. The tool uses an Hg/Xe 350 watt lamp to provide Ultraviolet energy primarily in the 365 nm and 405 nm wavelengths to the substrate surface.

Announcements

  • Update this with announcements as necessary

Capabilities

  • <5 µm feature size resolution
  • Aspect Ratio 1:3 fairly standard
  • Substrate thickness 200 µm to 5 mm possible

System Overview

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Hardware Details

  • Broadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec
  • 3" and 4" chucks
    • Special chuck for thick substrates available with staff permission. Please create a help desk ticket for installation of this chuck.
  • 4" and 5" mask holders
  • Flood exposure, soft, hard, and vacuum contact capable
  • Topside alignment
  • 10 mm stage travel, 100 mm microscope objective travel with split field view camera option

Substrate Requirements

  • Full 3" and 4" wafers standard
  • Glass Slides 1"x 3", 2"x 3"
  • Pieces possible with tool engineer approval
  • Mounting may be necessary if wafer has thru holes, etc. Create help desk ticket for assistance.
  • Substrate thickness 200 µm to 5 mm possible

Material Restrictions

The MJB 45S Mask Aligner is designated as a Semi-Clean class tool. All LNF approved Photoresists may be used in this tool. Please contact a tool engineer via the helpdesk ticket system for any material requests or questions.

Approved Materials

Polymer
  • SU-8
  • KMPR
  • SPR 220
  • PR 1800
  • PR 9260
  • Parylene
  • Polyimide
  • AZ9260

Supported Processes

Exposure of all LNF approved Photoresists (including SU-8 resists) is permitted in this tool. Data sheets for specific Photoresists can be found in the Solvent Bench 94 manual.

Standard Operating Procedure

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Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

The UV energy at the chuck face is routinely calibrated, so that the energy delivered corresponds to the display on the lamp controller. The energy delivered is normally in the 18-20 mw/cm2 range at the 405 nm wavelength. The WEC (Wedge Error Compensation) head is periodically checked for alignment. The contact pressure is checked and adjusted to provide approximately 300 microns contact on a standard thickness wafer (520 microns). Separation distance is checked when contact pressure is adjusted.