Difference between revisions of "Miller FPP-5000 4-Point Probe"

From LNF Wiki
Jump to navigation Jump to search
Line 41: Line 41:
 
* Separate sample holders (back pressure plate and ring) are available for pieces, 4" and 6" wafers.
 
* Separate sample holders (back pressure plate and ring) are available for pieces, 4" and 6" wafers.
 
* Sample must be larger than ~ 1 cm x 1 cm (probe head width is 4.8 mm).
 
* Sample must be larger than ~ 1 cm x 1 cm (probe head width is 4.8 mm).
* Samples smaller than 2.5 inches in diameter require a geometric correction factor.
+
* Samples smaller than 2.5 inches in diameter require a geometric correction factor.  Please see [[Four point probe]] technology page for more information.
  
 
===Material restrictions===
 
===Material restrictions===

Revision as of 12:29, 10 February 2016

Miller FPP-5000 4-Point Probe
84000.jpg
Equipment Details
Technology Metrology
Materials Restriction Metals
Sample Size pieces up to 4" and 6" wafers
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The Miller FPP-5000 4-Point Probe is used to measure resistive properties of semiconductor wafers and thin films.

Announcements

  • None at this time.

Capabilities

  • This tool is typically used to measure sheet resistance, but can also be set up to to calculate and display V/I, resistivity, and thickness.
  • Measurement ranges:
    • Sheet resistance: 1.1 mΩ/square to 450 kΩ/square
    • V/I: 0.25 mΩ to 99.9 kΩ
    • Slice resistivity: 4.12E-2 mΩ-cm to 17.1 kΩ-cm
    • Thickness: 20 Å to 243 kÅ
  • Self calibration and zero circuitry ensures high accuracy of ±0.5% on all readings between 5 mΩ to 5 kΩ. No more than ±8.0% at the extreme limits of the range.
  • Optional penetrate function available to breakdown thin oxide layers. If selected, a 4 ms pulse of ~200 V is applied to probes before the measurement is taken. This pulse should be sufficient to break through approximately 700 Å of SiO2 or 2200 Å of Al203.
  • Optional dopant type test is also available for doped layers. A rectification test is performed first, followed by a thermal test if needed. If the results are inconclusive the N and P indicators are simultaneously illuminated.

System overview

Hardware details

  • Voltage Detector Impedance: 1E12 Ω
  • Current source range: 250 nA to 500 mA
  • Current source voltage compliance at 500 mA: -45 V
  • Probe spacing = 0.0625 inches = 1.59 mm

Substrate requirements

  • Separate sample holders (back pressure plate and ring) are available for pieces, 4" and 6" wafers.
  • Sample must be larger than ~ 1 cm x 1 cm (probe head width is 4.8 mm).
  • Samples smaller than 2.5 inches in diameter require a geometric correction factor. Please see Four point probe technology page for more information.

Material restrictions

The Miller FPP-5000 4-Point Probe is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Sheet resistance, V/I, slice resistivity, and thickness functions are selectable by push buttons on the front panel of the tool. See the Standard Operating Procedure (SOP) below for more details.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will arrange a time with you to schedule the tool for training and checkout.

Maintenance

Probe head is replaced and unit is sent out for calibration as needed.

Users are not authorized to perform any maintenance on this equipment.