Difference between revisions of "NP12 nanoPREP"

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Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
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|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
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The nP12 is an atmospheric plasma tool that generates a N<sub>2</sub> plasma which scans over the wafer surface.  It is used for wafer surface modification, usually plasma activation prior to [[Wafer_bonding|wafer bonding]].  Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables [[Fusion_bonding|fusion bonding]] of [[Silicon|si]] substrates.
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The nP12 is an atmospheric plasma tool that generates a N<sub>2</sub> plasma which scans over the wafer surface.  It is used for wafer surface modification, usually [[Plasma_activation|plasma activation]] prior to [[Wafer_bonding|wafer bonding]].  Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables [[Fusion_bonding|fusion bonding]] of [[Silicon|si]] substrates.
  
==Announcements==
 
*None at this time.
 
  
 
==Capabilities==
 
==Capabilities==
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===Substrate requirements===
 
===Substrate requirements===
 
* 10 mm pieces up to 300 mm diameter wafers
 
* 10 mm pieces up to 300 mm diameter wafers
* Any non restricted substrate materials
 
 
* Mounting may be advisable.  Discuss with a tool engineer
 
* Mounting may be advisable.  Discuss with a tool engineer
 
* Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for
 
* Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for
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This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials.  Here is a chart of characterized materials and their surface energy over time.
 
This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials.  Here is a chart of characterized materials and their surface energy over time.
 
If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
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{{disputed-section}}
  
 
==Standard operating procedure==
 
==Standard operating procedure==

Latest revision as of 09:48, 2 February 2022

NP12 nanoPREP
143001.jpg
Equipment Details
Technology Plasma activation
Materials Restriction Semi-Clean
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The nP12 is an atmospheric plasma tool that generates a N2 plasma which scans over the wafer surface. It is used for wafer surface modification, usually plasma activation prior to wafer bonding. Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables fusion bonding of si substrates.


Capabilities

  • 500 W direct N2 plasma
  • Programmable scan speed and dose
  • Adjustable for various substrate thicknesses up to several mm
  • Wafers from 10 mm pieces up to 300 mm diameter

System overview

Hardware details

  • N2 plasma
  • Plasma scan of substrate surface is at atmosphere
  • Programmable plasma power

Substrate requirements

  • 10 mm pieces up to 300 mm diameter wafers
  • Mounting may be advisable. Discuss with a tool engineer
  • Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for

Material restrictions

The NP12 nanoPREP is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials. Here is a chart of characterized materials and their surface energy over time. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Ideally practice with your mentor or another authorized user operating the tool.
  3. Create a Helpdesk Ticket requesting training/checkout.
  4. A tool engineer will schedule a time training/checkout.

Maintenance

  • Test wafers are run monthly and the static contact angle of water on the surface is checked
  • The scan head height is checked or adjusted as needed