Difference between revisions of "NP12 nanoPREP"

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Set the Process Technology (see subcategories on Equipment page)  
 
Set the Process Technology (see subcategories on Equipment page)  
--> {{#vardefine:technology|Plasma Activation}} <!--
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--> {{#vardefine:technology|Plasma activation}} <!--
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals  
 
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|gases =  
 
|gases =  
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
 
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://link.to.google.doc/preview SOP]
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|sop = [https://docs.google.com/document/d/1SpYgBOOTt9VrZB0aEVttLnIHDeG4bn4czIIwfaIznk4/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
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The nP12 is an atmospheric plasma tool that generates a N<sub>2</sub> plasma which scans over the wafer surface.  It is used for wafer surface modification, usually [[Plasma_activation|plasma activation]] prior to [[Wafer_bonding|wafer bonding]].  Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables [[Fusion_bonding|fusion bonding]] of [[Silicon|si]] substrates.
  
{{warning|This page has not been released yet.}}
 
 
<!-- Insert the tool description here -->
 
 
==Announcements==
 
*Update this with announcements as necessary
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate
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* 500 W direct N<sub>2</sub> plasma
* Resolution
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* Programmable scan speed and dose
* Aspect Ratio
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* Adjustable for various substrate thicknesses up to several mm
* Thickness range
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* Wafers from 10 mm pieces up to 300 mm diameter
  
 
==System overview==
 
==System overview==
 
===Hardware details===
 
===Hardware details===
* Gases
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* N<sub>2</sub> plasma
* Pressure
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* Plasma scan of substrate surface is at atmosphere
* Chuck
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* Programmable plasma power
* Chamber
 
* RF / Power Specs
 
* Chemicals
 
  
 
===Substrate requirements===
 
===Substrate requirements===
* Wafer Size
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* 10 mm pieces up to 300 mm diameter wafers
* Wafer type
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* Mounting may be advisable.  Discuss with a tool engineer
* Any mounting?
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* Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for
* Wafer thickness
 
  
 
===Material restrictions===
 
===Material restrictions===
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==Supported processes==  
 
==Supported processes==  
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
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This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials. Here is a chart of characterized materials and their surface energy over time.
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
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If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
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{{disputed-section}}
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
  
 
==Standard operating procedure==
 
==Standard operating procedure==
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{{cleanup-manual}}
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
{{#widget:GoogleDoc|key=1SpYgBOOTt9VrZB0aEVttLnIHDeG4bn4czIIwfaIznk4}}
 
{{#widget:GoogleDoc|key=1SpYgBOOTt9VrZB0aEVttLnIHDeG4bn4czIIwfaIznk4}}
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<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [http://examplelink.com here].
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# Ideally practice with your mentor or another authorized user operating the tool.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training/checkout.
# A tool engineer will schedule a time for initial training.
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# A tool engineer will schedule a time training/checkout.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Complete the SOP quiz [http://examplelink.com here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
 
==Maintenance==  
 
==Maintenance==  
<!-- Describe standard maintenance/qualification tests here -->
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*Test wafers are run monthly and the static contact angle of water on the surface is checked
 
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*The scan head height is checked or adjusted as needed
===Process name===
 
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 
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|url=chart url
 
|width=800
 
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Latest revision as of 08:48, 2 February 2022

NP12 nanoPREP
143001.jpg
Equipment Details
Technology Plasma activation
Materials Restriction Semi-Clean
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The nP12 is an atmospheric plasma tool that generates a N2 plasma which scans over the wafer surface. It is used for wafer surface modification, usually plasma activation prior to wafer bonding. Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables fusion bonding of si substrates.


Capabilities

  • 500 W direct N2 plasma
  • Programmable scan speed and dose
  • Adjustable for various substrate thicknesses up to several mm
  • Wafers from 10 mm pieces up to 300 mm diameter

System overview

Hardware details

  • N2 plasma
  • Plasma scan of substrate surface is at atmosphere
  • Programmable plasma power

Substrate requirements

  • 10 mm pieces up to 300 mm diameter wafers
  • Mounting may be advisable. Discuss with a tool engineer
  • Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for

Material restrictions

The NP12 nanoPREP is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

This tool is primarily used to plasma activate the surface of Si substrates for direct wafer bonding, however it will perform surface modification of many materials. Here is a chart of characterized materials and their surface energy over time. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Ideally practice with your mentor or another authorized user operating the tool.
  3. Create a Helpdesk Ticket requesting training/checkout.
  4. A tool engineer will schedule a time training/checkout.

Maintenance

  • Test wafers are run monthly and the static contact angle of water on the surface is checked
  • The scan head height is checked or adjusted as needed