Difference between revisions of "NanoSpec 6100"

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<!--In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.-->
 
<!--In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.-->
  
{{cleanup-manual|SOP}}
 
 
==Standard operating procedure==
 
==Standard operating procedure==
 
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Latest revision as of 17:28, 18 October 2021

NanoSpec 6100
80030.jpg
Equipment Details
Technology Metrology
Materials Restriction General
Sample Size pieces and up to 8" wafers
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
Maintenance Maintenance


The NanoSpec 6100 measures the thickness of transparent and semi-transparent thin films and film stacks through non-contact spectroscopic reflectometry. The automated stage and autofocus system enables rapid generation of film thickness uniformity maps.

Announcements

None at this time.

Capabilities

  • Film thicknesses in the range of 200 Å to several µm
Maximum thickness is film dependent.
  • Up to three layers of thin films
  • The NanoSpec measures film thickness using fixed “material file” optical constant values for n and k versus wavelength. If the optical properties of your film differ from the material file, your film thickness measurement may be inaccurate.

System overview

Hardware details

  • Halogen light source in visible wavelength range 400 - 800 nm.
  • Measurement spot size is objective dependent
    • 4x objective → 62.5 µm in diameter
    • 10x objective → 25 µm in diameter
  • Measurement time: typically < 1 sec/site
  • Automated stage for rapid wafer map data collection

Substrate requirements

  • Wafer Size - pieces up to 8" wafers
  • Wafer type - silicon, gallium arsenide, indium phosphide, and other materials available in material file database (Note: thin films on transparent substrates cannot be measured.)
  • Maximum sample thickness - 1.25 mm (4" mounted on 6")

Material restrictions

The NanoSpec 6100 is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


  • No liquids or uncured spin on films.
  • No solvents under lenses. Solvents will degrade lens coatings.

Supported processes

  • There are 200 programs and recipes on the NanoSpec as well as many optical constant material files.
  • If the program, recipe, or material file you need are not on the tool, please submit a Helpdesk ticket to contact the tool owner for assistance.
  • The Woollam M-2000 Ellipsometer can be used to measure optical constants for custom films.


Standard operating procedure

Widget text will go here.

Checkout procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will coordinate a time for training.

Maintenance

  • Lamp is replaced as needed.