Difference between revisions of "Nanoquest II Ion Mill"
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==Announcements== | ==Announcements== | ||
− | + | None at this time. | |
==Capabilities== | ==Capabilities== | ||
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==Standard operating procedure== | ==Standard operating procedure== | ||
− | + | {{note|This SOP is still currently a draft. Please use caution when using the tool and take note of any additional information or changes provided by the tool engineer.|error}} | |
− | {{#widget:GoogleDoc|key= | + | {{#widget:GoogleDoc|key=1j8K-iHGOmzttY0evotZVnLViYATzzBc3wD9zD-pr6O8}} |
==Checkout procedure== | ==Checkout procedure== |
Revision as of 10:05, 17 December 2020
Nanoquest II Ion Mill | |
---|---|
Equipment Details | |
Manufacturer | Intlvac Thin Film |
Model | Nanoquest II |
Technology | Ion milling |
Materials Restriction | Metals |
Sample Size | 100 mm, 150 mm |
Gases Used | Ar, O2, N2 |
Equipment Manual | |
Overview | System Overview |
Operating Procedure | not released |
Supported Processes | Supported Processes |
User Processes | User Processes |
Maintenance | Maintenance |
This page has not been released yet. |
The Nanoquest II Ion Mill is a...
Contents
Announcements
None at this time.
Capabilities
- Etch rates of < 2 nm/min up to > 40 nm/min for a wide variety of materials
System overview
Hardware details
- Pressure
- Ebara EMT3300MK turbo pump
- Base pressure < 10-7
- Actively cooled platen with Dri-chuck mounting system
- 100 mm and 150 mm chucks available
- 5°C - 40°C range
- KRI RFICP220 gridded ion source
- Beam current up to 1500 mA
- Beam voltage up to 1000 V
- 3" dia RF magnetron sputter cathode
Substrate requirements
- 100 mm or 150 mm wafers
- Smaller samples may be mounted to a carrier wafer at the sample mounting station
- 3 mm max height[dubious ]
Material restrictions
The Nanoquest II Ion Mill is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
Initial characterization data for several recipes provided by the vendor are shown in the table below. Data is for thermal oxide and SPR 220. Uniformity data is from the thermal oxide measurement on 150 mm wafers with 10 mm edge exclusion.
Recipe Name | Oxide Etch Rate (nm/min) |
SPR 220 Etch Rate (nm/min) |
Uniformity (10 mm EE) |
---|---|---|---|
LNF_200VB_165IB_40VA | 3.4 | 1.8 | 4.1% |
LNF_300VB_320IB_60VA | 8.9 | 4.5% | |
LNF_400VB_510IB_80VA | 16.6 | 14.2 | 3.9% |
LNF_500VB_740IB_100VA | 27.2 | 21.7 | 4.9% |
LNF_600VB_500IB_120VA | 23.2 | 18.6 | 1.5% |
LNF_600VB_990IB_120VA | 40.2 | 35.1 | 3.1% |
LNF_800VB_500IB_160VA | 25.4 | 3.9% |
Standard operating procedure
Widget text will go here.
Checkout procedure
Please create a helpdesk ticket if you have an urgent, high priority need for the tool and include as much process information as possible. A staff member will contact you regarding your process and schedule.
Maintenance
Process name