Nanoquest II Ion Mill
|Nanoquest II Ion Mill|
|Manufacturer||Intlvac Thin Film|
|Sample Size||100 mm, 150 mm|
|Gases Used||Ar, O2, N2|
|Operating Procedure||not released|
|Supported Processes||Supported Processes|
|User Processes||User Processes|
|Warning:||This page has not been released yet.|
The Nanoquest II Ion Mill is a...
- Etch rates of <2 nm/min up to >40 nm/min for a wide variety of materials
- Ebara EMT3300MK turbo pump
- Base pressure < 10-7
- Actively cooled platen with Dri-chuck mounting system
- 100 mm and 150 mm chucks available
- 5°C - 40°C range
- KRI RFICP220 gridded ion source
- Beam current up to 1500 mA
- Beam voltage up to 1000 V
- 3" dia RF magnetron sputter cathode
- 100 mm or 150 mm wafers
The Nanoquest II Ion Mill is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email email@example.com for any material requests or questions.
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Nanoquest II Ion Mill user processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard operating procedure
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Please create a helpdesk ticket if you have an urgent, high priority need for the tool and include as much process information as possible. A staff member will contact you regarding your process and schedule.