Nanoquest II Ion Mill

Nanoquest II Ion Mill
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Equipment Details
Manufacturer	Intlvac Thin Film
Model	Nanoquest II
Technology	Ion milling
Materials Restriction	Metals
Sample Size	100 mm, 150 mm
Gases Used	Ar, O2, N2
Equipment Manual
Overview	System Overview
Operating Procedure	not released
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

Warning:

This page has not been released yet.

The Nanoquest II Ion Mill is a...

Announcements

Currently, use of this tool is restricted to users with high priority deadlines and who are assisting with etch rate characterization. If you believe your process falls into these categories, please create a helpdesk ticket. There will be extensive initial training and practice due to the limited documentation currently published for the tool.

Capabilities

• Etch rates of <2 nm/min up to >40 nm/min for a wide variety of materials

System overview

Hardware details

• Source Gases
  • Ar - 50 sccm
  • O₂ - 50 sccm
  • N₂ - 50 sccm
• Gas Ring
  • O₂ - 50 sccm
  • N₂ - 50 sccm

Each gas can be delivered to either the source or gas ring, but not both

• Pressure
  • Ebara EMT3300MK turbo pump
  • Base pressure < 10^-7
• Actively cooled platen with Dri-chuck mounting system
  • 100 mm and 150 mm chucks available
  • 5°C - 40°C range
• KRI RFICP220 gridded ion source
  • Beam current up to 1500 mA
  • Beam voltage up to 1000 V
• 3" dia RF magnetron sputter cathode

Substrate requirements

• 100 mm or 150 mm wafers
  • Smaller samples may be mounted to a carrier wafer at the sample mounting station
  • 3 mm max height

Material restrictions

The Nanoquest II Ion Mill is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

Main article: Nanoquest II Ion Mill/Processes

Initial characterization data for several recipes provided by the vendor are shown in the table below. Data is for thermal oxide and SPR 220. Uniformity data is from the thermal oxide measurement on 150 mm wafers with 10 mm edge exclusion.

Recipe Name	Oxide Etch Rate (nm/min)	SPR 220 Etch Rate (nm/min)	Uniformity (10 mm EE)
LNF_200VB_165IB_40VA	3.4	1.8	4.1%
LNF_300VB_320IB_60VA	8.9		4.5%
LNF_400VB_510IB_80VA	16.6	14.2	3.9%
LNF_500VB_740IB_100VA	27.2	21.7	4.9%
LNF_600VB_500IB_120VA	23.2	18.6	1.5%
LNF_600VB_990IB_120VA	40.2	35.1	3.1%
LNF_800VB_500IB_160VA	25.4		3.9%

Standard operating procedure

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Checkout procedure

Please create a helpdesk ticket if you have an urgent, high priority need for the tool and include as much process information as possible. A staff member will contact you regarding your process and schedule.