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The Nanoquest II Ion Mill is a...

Nanoquest II Ion Mill
Equipment Details
Manufacturer Intlvac Thin Film
Model Nanoquest II
Technology Ion milling
Materials Restriction Metals
Sample Size 100 mm, 150 mm
Gases Used Ar, O2, N2
Equipment Manual
Overview System Overview
Operating Procedure not released
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

Contents

Announcements

Currently, use of this tool is restricted to users with high priority deadlines and who are assisting with etch rate characterization. If you believe your process falls into these categories, please create a helpdesk ticket. There will be extensive initial training and practice due to the limited documentation currently published for the tool.

Capabilities

  • Etch rates of <2 nm/min up to >40 nm/min for a wide variety of materials

System overview

Hardware details

  • Source Gases
    • Ar - 50 sccm
    • O2 - 50 sccm
    • N2 - 50 sccm
  • Gas Ring
    • O2 - 50 sccm
    • N2 - 50 sccm
Each gas can be delivered to either the source or gas ring, but not both
  • Pressure
    • Ebara EMT3300MK turbo pump
    • Base pressure < 10-7
  • Actively cooled platen with Dri-chuck mounting system
    • 100 mm and 150 mm chucks available
    • 5°C - 40°C range
  • KRI RFICP220 gridded ion source
    • Beam current up to 1500 mA
    • Beam voltage up to 1000 V
  • 3" dia RF magnetron sputter cathode

Substrate requirements

Material restrictions

The Nanoquest II Ion Mill is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

Initial characterization data for several recipes provided by the vendor are shown in the table below. Data is for thermal oxide and SPR 220. Uniformity data is from the thermal oxide measurement on 150 mm wafers with 10 mm edge exclusion.

Recipe Name Oxide Etch Rate
(nm/min)
SPR 220 Etch Rate
(nm/min)
Uniformity
(10 mm EE)
LNF_200VB_165IB_40VA 3.4 1.8 4.1%
LNF_300VB_320IB_60VA 8.9 4.5%
LNF_400VB_510IB_80VA 16.6 14.2 3.9%
LNF_500VB_740IB_100VA 27.2 21.7 4.9%
LNF_600VB_500IB_120VA 23.2 18.6 1.5%
LNF_600VB_990IB_120VA 40.2 35.1 3.1%
LNF_800VB_500IB_160VA 25.4 3.9%


Standard operating procedure

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Checkout procedure

Please create a helpdesk ticket if you have an urgent, high priority need for the tool and include as much process information as possible. A staff member will contact you regarding your process and schedule.

Maintenance

Process name