Difference between revisions of "Nickel"
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===Deposition Equipment=== | ===Deposition Equipment=== | ||
| − | * | + | *Evaporation |
| − | ** [[Angstrom Engineering | + | ** [[Angstrom Engineering Evovac Evaporator]] |
** [[Cooke Evaporator]] | ** [[Cooke Evaporator]] | ||
** [[SJ-20 Evaporator]] | ** [[SJ-20 Evaporator]] | ||
| + | *Sputtering | ||
| + | ** [[PVD 75 Proline]] | ||
===Etching Equipment=== | ===Etching Equipment=== | ||
| − | * | + | * Wet Etching |
| + | ** [[Acid Bench 92]] | ||
| + | ** [[Acid Bench 12]] | ||
| + | ** [[Acid Bench 73]] | ||
| + | * RIE | ||
| + | ** [[Nanoquest II Ion Mill]] | ||
| + | |||
===Characterization Equipment=== | ===Characterization Equipment=== | ||
*Metrology/Characterization equipment available in the LNF for measuring physical, optical, and surface properties of this material. | *Metrology/Characterization equipment available in the LNF for measuring physical, optical, and surface properties of this material. | ||
| Line 24: | Line 32: | ||
==Processes== | ==Processes== | ||
===Deposition Processes=== | ===Deposition Processes=== | ||
| − | * | + | * [[Electron beam evaporation]] |
| + | * [[Sputter deposition]] | ||
===Etching Processes=== | ===Etching Processes=== | ||
| − | * | + | * Nickel can be etched with [[Piranha Etch]] (380 nm/min), dilute [[Aqua Regia]] (100 nm/min) |
| + | *[[Plasma etching]] | ||
===Characterization Processes=== | ===Characterization Processes=== | ||
| Line 37: | Line 47: | ||
==References== | ==References== | ||
| − | * | + | * [https://drive.google.com/open?id=0B7eVu3mcqumAbTQ0aFBxXzYyNDg KR Williams, K Gupta, M Wasilik, "Etch Rates for Micromachining Processing - Part II", JMEMS vol. 12 No 6, Dec 2003] |
Latest revision as of 11:14, 24 April 2020
 Warning: | This page has not been released yet. |
Nickel (Ni) is an element with the atomic number 28. It is silvery-white and lustrous in appearance with a slightly golden tinge. Nickel is a transition metal and is a very hard and ductile material.
Contents
Equipment
Process technologies that can be used to deposit/pattern this material.
Deposition Equipment
- Evaporation
- Sputtering
Etching Equipment
- Wet Etching
- RIE
Characterization Equipment
- Metrology/Characterization equipment available in the LNF for measuring physical, optical, and surface properties of this material.
Applications
- Discuss common uses/applications for this material. Why this materials is used in the LNF?
Processes
Deposition Processes
Etching Processes
- Nickel can be etched with Piranha Etch (380 nm/min), dilute Aqua Regia (100 nm/min)
- Plasma etching
Characterization Processes
- List of techniques for metrology/characterization can be used with this material and relevant process information specific to this material associated with this equipment/type of process.
Other Relevant Material Information
Technical Data
- Charts or specific LNF related data for this material.
