Difference between revisions of "Oxford Plasmalab System 100"

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{{#vardefine:toolid|10051}} {{#vardefine:technology|RIE}} {{#vardefine:restriction|3}}
{{#vardefine:toolid|10051}}
 
<!-- Set the Process Technology (see subcategories on Equipment page) -->
 
{{#vardefine:technology|Process Technology}}
 
<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
 
{{#vardefine:restriction|1, 2, 3}}
 
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
 
|materials =  
 
|materials =  
|mask =
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|mask = [[Photoresist|Pr]], [[SiO2|SiO<sub>2</sub>]]
|size =
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|size = 100 mm
|chemicals =
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|chemicals =  
|gases =  
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|gases = [[Argon|Ar]], [[BCl3|BCl<sub>3</sub>]], [[CH4|CH<sub>4</sub>]], [[Cl2|Cl<sub>2</sub>]], [[H2|H<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
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|overview = [https://docs.google.com/document/d/1_lgkLxDpHWRDIsubuSP769QsoE1kvMf9fsR9gx0KKqg/preview System Overview]
|sop = [https://link.to.google.doc/preview SOP]
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|sop = [https://docs.google.com/document/d/1wzRPxOz2Uiw5_BCchsU6P1c7PVq7QlHwh1CrMP85u5Y/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
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|maintenance = [https://docs.google.com/document/d/1yBYbM2C5RhAT9IGcxs07J5__T7OdB1r54BrEYehBVss/preview Maintenance]
 
}}
 
}}
 
{{warning|This page has not been released yet.}}
 
 
 
<!-- Insert the tool description here -->
 
<!-- Insert the tool description here -->
The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches.  It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer.  The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces.  It has Ar, BCl3 , CH4 , Cl2,  H2 , and O2  gases available.  The tool also has a cryo chuck that can go down to -150°C and up to 150°C
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The Oxford Plasmalab System 100 is a 100 mm [[reactive ion etching]] tool designed for a variety of etches.  It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer.  The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces.  With a variety of gases and a cryo chuck it is ideal for anisotropic [[polymer]] etching, [[Compound semiconductor|III-V's]] and a variety of other materials.
 
 
 
 
==Announcements==
 
*None
 
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate
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A wide range of materials can be etched:
* Resolution
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* Anisotropic cyro polymer etching
* Aspect Ratio
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* [[Gallium_nitride|GaN]]
* Thickness range
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* [[Gallium_arsenide|GaAs]]
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* [[Aluminum]]
  
 
==System Overview==
 
==System Overview==
 
===Hardware Details===
 
===Hardware Details===
 
* Gases
 
* Gases
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** [[Argon|Ar]] - 100 sccm
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** [[BCl3|BCl<sub>3</sub>]] - 41 sccm
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** [[Methane|CH<sub>4</sub>]] - 50 sccm
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** [[Cl2|Cl<sub>2</sub>]] - 50 sccm
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** [[H2|H<sub>2</sub>]] - 50 sccm
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** [[O2|O<sub>2</sub>]] - 100 sccm
 
* Pressure
 
* Pressure
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** 1 - 100 mTorr
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** TD20 Leybold Turbo Drive Classic
 
* Chuck
 
* Chuck
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** Mechanical clamping chuck
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** 10-50 Torr Backside He cooling
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** 50°C Standard Temp (-150°C to 150°C Range)
 
* Chamber
 
* Chamber
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** 60°C heated aluminum walls
 
* RF / Power Specs
 
* RF / Power Specs
* Chemicals
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** 600 W ICP - AE RFX 600A
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** 600 W Bias - AE RFX 600A Bias
  
 
===Substrate Requirements===
 
===Substrate Requirements===
* Wafer Size
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* 100 mm
* Wafer type
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* Pieces mounted with santovac or crystalbond
* Any mounting?
 
* Wafer thickness
 
  
 
===Material Restrictions===
 
===Material Restrictions===
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==Supported Processes==  
 
==Supported Processes==  
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
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{{note|We are in the process of developing standard processes for the Oxford}}
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The standard processes for the Oxford Plasmalab System 100 are described in detail on the [[/Processes/]] page.
  
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
 
 
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
 
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
  
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
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{{#widget:GoogleDoc|key=1wzRPxOz2Uiw5_BCchsU6P1c7PVq7QlHwh1CrMP85u5Y}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
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# Read through this page and the Standard Operating Procedure above.
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# Complete the [[Sample_mounting#Training_modules|sample mounting course]].  If you have already completed this for another tool, you do not need to complete it again.
# Complete the training request form [http://examplelink.com here].
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# Read through the User Manual above.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
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# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform process request form].
# A tool engineer will schedule a time for initial training.
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# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting a checkout session.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
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# Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer.
# Complete the SOP quiz [http://examplelink.com here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
  
 
==Maintenance==  
 
==Maintenance==  
 
Once a month the chamber is cleaned and the tool inspected.
 
Once a month the chamber is cleaned and the tool inspected.

Latest revision as of 12:22, 16 December 2021

Oxford Plasmalab System 100
10051.jpg
Equipment Details
Technology RIE
Materials Restriction Metals
Mask Materials Pr, SiO2
Sample Size 100 mm
Gases Used Ar, BCl3, CH4, Cl2, H2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for anisotropic polymer etching, III-V's and a variety of other materials.

Capabilities

A wide range of materials can be etched:

System Overview

Hardware Details

  • Gases
    • Ar - 100 sccm
    • BCl3 - 41 sccm
    • CH4 - 50 sccm
    • Cl2 - 50 sccm
    • H2 - 50 sccm
    • O2 - 100 sccm
  • Pressure
    • 1 - 100 mTorr
    • TD20 Leybold Turbo Drive Classic
  • Chuck
    • Mechanical clamping chuck
    • 10-50 Torr Backside He cooling
    • 50°C Standard Temp (-150°C to 150°C Range)
  • Chamber
    • 60°C heated aluminum walls
  • RF / Power Specs
    • 600 W ICP - AE RFX 600A
    • 600 W Bias - AE RFX 600A Bias

Substrate Requirements

  • 100 mm
  • Pieces mounted with santovac or crystalbond

Material Restrictions

The Oxford Plasmalab System 100 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

We are in the process of developing standard processes for the Oxford

The standard processes for the Oxford Plasmalab System 100 are described in detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Complete the sample mounting course. If you have already completed this for another tool, you do not need to complete it again.
  2. Read through the User Manual above.
  3. Complete the process request form.
  4. Create a helpdesk ticket requesting a checkout session.
  5. Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer.

Maintenance

Once a month the chamber is cleaned and the tool inspected.