Difference between revisions of "Oxford Plasmalab System 100"
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|maintenance = [https://docs.google.com/document/d/1yBYbM2C5RhAT9IGcxs07J5__T7OdB1r54BrEYehBVss/preview Maintenance] | |maintenance = [https://docs.google.com/document/d/1yBYbM2C5RhAT9IGcxs07J5__T7OdB1r54BrEYehBVss/preview Maintenance] | ||
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<!-- Insert the tool description here --> | <!-- Insert the tool description here --> | ||
| − | The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for | + | The Oxford Plasmalab System 100 is a 100 mm [[reactive ion etching]] tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for anisotropic [[polymer]] etching, [[Compound semiconductor|III-V's]] and a variety of other materials. |
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==Capabilities== | ==Capabilities== | ||
<!--A more general description of what the tool is capable of doing.--> | <!--A more general description of what the tool is capable of doing.--> | ||
| − | + | A wide range of materials can be etched: | |
| − | * | + | * Anisotropic cyro polymer etching |
| − | * GaAs | + | * [[Gallium_nitride|GaN]] |
| − | * Aluminum | + | * [[Gallium_arsenide|GaAs]] |
| + | * [[Aluminum]] | ||
==System Overview== | ==System Overview== | ||
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** 60°C heated aluminum walls | ** 60°C heated aluminum walls | ||
* RF / Power Specs | * RF / Power Specs | ||
| − | ** | + | ** 600 W ICP - AE RFX 600A |
| − | ** | + | ** 600 W Bias - AE RFX 600A Bias |
===Substrate Requirements=== | ===Substrate Requirements=== | ||
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==Supported Processes== | ==Supported Processes== | ||
| − | We are in the process of developing standard processes for the Oxford | + | {{note|We are in the process of developing standard processes for the Oxford}} |
| + | The standard processes for the Oxford Plasmalab System 100 are described in detail on the [[/Processes/]] page. | ||
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. | In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. | ||
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==Checkout Procedure== | ==Checkout Procedure== | ||
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| − | # Read through | + | # Complete the [[Sample_mounting#Training_modules|sample mounting course]]. If you have already completed this for another tool, you do not need to complete it again. |
| − | + | # Read through the User Manual above. | |
| − | # Complete the | + | # Complete the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform process request form]. |
| − | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} | + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] requesting a checkout session. |
| − | # | + | # Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer. |
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==Maintenance== | ==Maintenance== | ||
Once a month the chamber is cleaned and the tool inspected. | Once a month the chamber is cleaned and the tool inspected. | ||
Latest revision as of 12:22, 16 December 2021
| Oxford Plasmalab System 100 | |
|---|---|
 | |
| Equipment Details | |
| Technology | RIE |
| Materials Restriction | Metals |
| Mask Materials | Pr, SiO2 |
| Sample Size | 100 mm |
| Gases Used | Ar, BCl3, CH4, Cl2, H2, O2 |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
| Maintenance | Maintenance |
The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for anisotropic polymer etching, III-V's and a variety of other materials.
Contents
Capabilities
A wide range of materials can be etched:
System Overview
Hardware Details
- Gases
- Pressure
- 1 - 100 mTorr
- TD20 Leybold Turbo Drive Classic
- Chuck
- Mechanical clamping chuck
- 10-50 Torr Backside He cooling
- 50°C Standard Temp (-150°C to 150°C Range)
- Chamber
- 60°C heated aluminum walls
- RF / Power Specs
- 600 W ICP - AE RFX 600A
- 600 W Bias - AE RFX 600A Bias
Substrate Requirements
- 100 mm
- Pieces mounted with santovac or crystalbond
Material Restrictions
The Oxford Plasmalab System 100 is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Approved materials
Supported Processes
We are in the process of developing standard processes for the Oxford
The standard processes for the Oxford Plasmalab System 100 are described in detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
Widget text will go here.
Checkout Procedure
- Complete the sample mounting course. If you have already completed this for another tool, you do not need to complete it again.
- Read through the User Manual above.
- Complete the process request form.
- Create a helpdesk ticket requesting a checkout session.
- Authorization will be provided pending successful completion of the quiz and demonstration of proper tool use in the presence of a tool engineer.
Maintenance
Once a month the chamber is cleaned and the tool inspected.
