Difference between revisions of "Oxford Plasmalab System 100"

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The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches.  It’s an ICP based etcher designed to etch pieces mounted to a  100 mm wafer.  The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces.  It has Ar, BCl3 , CH4 , Cl2,  H2 , and O2  gases available.  The tool also has a cryo chuck that can go down to -150°C and up to 150°C
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==Announcements==
 
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Once a month the chamber is cleaned and the tool inspected.
 
 
===Process Name===
 
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Revision as of 13:37, 10 June 2015



Oxford Plasmalab System 100
10051.jpg
Equipment Details
Technology Process Technology
Materials Restriction Undefined
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


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The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. It has Ar, BCl3 , CH4 , Cl2, H2 , and O2 gases available. The tool also has a cryo chuck that can go down to -150°C and up to 150°C


Announcements

  • None

Capabilities

  • Etch Rate
  • Resolution
  • Aspect Ratio
  • Thickness range

System Overview

Hardware Details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate Requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material Restrictions

The Oxford Plasmalab System 100 is designated as a Undefined class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

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Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a month the chamber is cleaned and the tool inspected.