Difference between revisions of "Oxford Plasmalab System 100"

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{{#vardefine:technology|Process Technology}}
 
{{#vardefine:technology|Process Technology}}
 
<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
 
<!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals -->
{{#vardefine:restriction|1, 2, 3}}
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{{#vardefine:restriction|2}}
 
{{infobox equipment
 
{{infobox equipment
 
|caption =  
 
|caption =  
 
|materials =  
 
|materials =  
|mask =
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|mask = [[Photoresist|Pr]], [[SiO2|SiO<sub>2</sub>]]
|size =
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|size = 100 mm
|chemicals =
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|chemicals =  
|gases =  
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|gases = [[Argon|Ar]], [[BCl3|BCl<sub>3</sub>]], [[CH4|CH<sub>4</sub>]], [[Cl2|Cl<sub>2</sub>]], [[H2|H<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
+
|overview = [https://docs.google.com/document/d/1_lgkLxDpHWRDIsubuSP769QsoE1kvMf9fsR9gx0KKqg/preview System Overview]
|sop = [https://link.to.google.doc/preview SOP]
+
|sop = [https://docs.google.com/document/d/1wzRPxOz2Uiw5_BCchsU6P1c7PVq7QlHwh1CrMP85u5Y/preview SOP]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
 
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 
}}
 
}}
 
 
{{warning|This page has not been released yet.}}
 
{{warning|This page has not been released yet.}}
 
 
<!-- Insert the tool description here -->
 
<!-- Insert the tool description here -->
The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches.  It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer.  The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces.  It has Ar, BCl3 , CH4 , Cl2,  H2 , and O2  gases available.  The tool also has a cryo chuck that can go down to -150°C and up to 150°C
+
The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches.  It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer.  The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces.  With a variety of gases and a cryo chuck it is ideal for XYZ.
  
  
 
==Announcements==
 
==Announcements==
*None
+
* None
  
 
==Capabilities==
 
==Capabilities==
 
<!--A more general description of what the tool is capable of doing.-->
 
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate
+
{{expert-subject|need more info?}}
* Resolution
+
* Isotropic cyro polymer etching
* Aspect Ratio
+
* GaAs and GaN etching
* Thickness range
+
* Aluminum etching
  
 
==System Overview==
 
==System Overview==
 
===Hardware Details===
 
===Hardware Details===
 
* Gases
 
* Gases
 +
** [[Argon|Ar]] - 100 sccm
 +
** [[BCl3|BCl<sub>3</sub>]] - 41 sccm
 +
** [[CH4|CH<sub>4</sub>]] - 50 sccm
 +
** [[Cl2|Cl<sub>2</sub>]] - 50 sccm
 +
** [[H2|H<sub>2</sub>]] - 50 sccm
 +
** [[O2|O<sub>2</sub>]] - 100 sccm
 
* Pressure
 
* Pressure
 +
** 1 - 100 mTorr
 +
** TD20 Leybold Turbo Drive Classic
 
* Chuck
 
* Chuck
 +
** Mechanical clamping chuck
 +
** 10-50 Torr Backside He cooling
 +
** 50°C Standard Temp (-150°C to 150°C Range)
 
* Chamber
 
* Chamber
 +
** 60°C heated aluminum walls
 
* RF / Power Specs
 
* RF / Power Specs
* Chemicals
+
** 600W ICP - AE RFX 600A
 +
** 600W Bias - AE RFX 600A Bias
  
 
===Substrate Requirements===
 
===Substrate Requirements===
* Wafer Size
+
* 100 mm
* Wafer type
+
* Pieces mounted with santovac or crystalbond
* Any mounting?
 
* Wafer thickness
 
  
 
===Material Restrictions===
 
===Material Restrictions===
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==Supported Processes==  
 
==Supported Processes==  
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 
 
 
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
 
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
  
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
 
 
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
  
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=googledocid}}
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{{#widget:GoogleDoc|key=1wzRPxOz2Uiw5_BCchsU6P1c7PVq7QlHwh1CrMP85u5Y}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
<!-- Describe the checkout procedure for the tool. For example: -->
 
# Read through this page and the Standard Operating Procedure above.
 
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [http://examplelink.com here].
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{{disputed-section|Fix training request form}}
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# Complete the training request form [https://docs.google.com/a/lnf.umich.edu/forms/d/16kHlwOrAQk_nybzzXjYk78_aENmJiy33jJ7gj18lJKg/viewform here].
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
 
# A tool engineer will schedule a time for initial training.
 
# A tool engineer will schedule a time for initial training.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 +
{{disputed-section|Fix checkout quiz}}
 
# Complete the SOP quiz [http://examplelink.com here].
 
# Complete the SOP quiz [http://examplelink.com here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Revision as of 16:04, 10 June 2015



Oxford Plasmalab System 100
10051.jpg
Equipment Details
Technology Process Technology
Materials Restriction Semi-Clean
Mask Materials Pr, SiO2
Sample Size 100 mm
Gases Used Ar, BCl3, CH4, Cl2, H2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


Warning Warning: This page has not been released yet.

The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for XYZ.


Announcements

  • None

Capabilities

  • Isotropic cyro polymer etching
  • GaAs and GaN etching
  • Aluminum etching

System Overview

Hardware Details

  • Gases
    • Ar - 100 sccm
    • BCl3 - 41 sccm
    • CH4 - 50 sccm
    • Cl2 - 50 sccm
    • H2 - 50 sccm
    • O2 - 100 sccm
  • Pressure
    • 1 - 100 mTorr
    • TD20 Leybold Turbo Drive Classic
  • Chuck
    • Mechanical clamping chuck
    • 10-50 Torr Backside He cooling
    • 50°C Standard Temp (-150°C to 150°C Range)
  • Chamber
    • 60°C heated aluminum walls
  • RF / Power Specs
    • 600W ICP - AE RFX 600A
    • 600W Bias - AE RFX 600A Bias

Substrate Requirements

  • 100 mm
  • Pieces mounted with santovac or crystalbond

Material Restrictions

The Oxford Plasmalab System 100 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  1. Complete the training request form here.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  1. Complete the SOP quiz here.
  2. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a month the chamber is cleaned and the tool inspected.