Difference between revisions of "Oxford Plasmalab System 100"

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# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
{{disputed-section|Fix checkout quiz}}
 
{{disputed-section|Fix checkout quiz}}
# Complete the SOP quiz [http://examplelink.com here].
+
# Complete the SOP quiz [https://docs.google.com/a/lnf.umich.edu/forms/d/19OvPd9W2TnDWQiKvgSkLCfYPnKHIzl1dB7usneBFQqY/viewform here].
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
 
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
  
 
==Maintenance==  
 
==Maintenance==  
 
Once a month the chamber is cleaned and the tool inspected.
 
Once a month the chamber is cleaned and the tool inspected.

Revision as of 16:05, 29 July 2015



Oxford Plasmalab System 100
10051.jpg
Equipment Details
Technology RIE
Materials Restriction Semi-Clean
Mask Materials Pr, SiO2
Sample Size 100 mm
Gases Used Ar, BCl3, CH4, Cl2, H2, O2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for polymer etching, III-V's and a variety of other materials.


Announcements

  • None

Capabilities

A wide range of materials can be etched:

System Overview

Hardware Details

  • Gases
    • Ar - 100 sccm
    • BCl3 - 41 sccm
    • CH4 - 50 sccm
    • Cl2 - 50 sccm
    • H2 - 50 sccm
    • O2 - 100 sccm
  • Pressure
    • 1 - 100 mTorr
    • TD20 Leybold Turbo Drive Classic
  • Chuck
    • Mechanical clamping chuck
    • 10-50 Torr Backside He cooling
    • 50°C Standard Temp (-150°C to 150°C Range)
  • Chamber
    • 60°C heated aluminum walls
  • RF / Power Specs
    • 600W ICP - AE RFX 600A
    • 600W Bias - AE RFX 600A Bias

Substrate Requirements

  • 100 mm
  • Pieces mounted with santovac or crystalbond

Material Restrictions

The Oxford Plasmalab System 100 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

We are in the process of developing standard processes for the Oxford, which will be described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

Widget text will go here.

Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Create a Helpdesk Ticket requesting training.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  1. Complete the SOP quiz here.
  2. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a month the chamber is cleaned and the tool inspected.