Oxford Plasmalab System 100

Oxford Plasmalab System 100
Equipment Details
Technology	RIE
Materials Restriction	Semi-Clean
Mask Materials	Pr, SiO2
Sample Size	100 mm
Gases Used	Ar, BCl3, CH4, Cl2, H2, O2
Equipment Manual
Overview	System Overview
Operating Procedure	SOP
Supported Processes	Supported Processes
User Processes	User Processes
Maintenance	Maintenance

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The Oxford Plasmalab System 100 is a 100 mm reactive ion etching tool designed for a variety of etches. It’s an ICP based etcher designed to etch pieces mounted to a 100 mm wafer. The diameter of the source only allows it to uniformly etch the center ~1.5” of the wafer, making it perfect for pieces. With a variety of gases and a cryo chuck it is ideal for XYZ.

Announcements

• None

Capabilities

• Isotropic cyro polymer etching
• GaAs and GaN etching
• Aluminum etching

System Overview

Hardware Details

• Gases
  • Ar - 100 sccm
  • BCl₃ - 41 sccm
  • CH₄ - 50 sccm
  • Cl₂ - 50 sccm
  • H₂ - 50 sccm
  • O₂ - 100 sccm
• Pressure
  • 1 - 100 mTorr
  • TD20 Leybold Turbo Drive Classic
• Chuck
  • Mechanical clamping chuck
  • 10-50 Torr Backside He cooling
  • 50°C Standard Temp (-150°C to 150°C Range)
• Chamber
  • 60°C heated aluminum walls
• RF / Power Specs
  • 600W ICP - AE RFX 600A
  • 600W Bias - AE RFX 600A Bias

Substrate Requirements

• 100 mm
• Pieces mounted with santovac or crystalbond

Material Restrictions

The Oxford Plasmalab System 100 is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on Oxford Plasmalab System 100 User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

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Checkout Procedure

1. Read through this page and the Standard Operating Procedure above.

1. Complete the training request form here.
2. Create a Helpdesk Ticket requesting training.
3. A tool engineer will schedule a time for initial training.
4. Practice with your mentor or another authorized user until you are comfortable with tool operation.

1. Complete the SOP quiz here.
2. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Maintenance

Once a month the chamber is cleaned and the tool inspected.