P5000 PECVD

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P5000 PECVD
21051.jpg
Equipment Details
Technology PECVD
Materials Restriction Semi-Clean
Material Processed SiO2, Si3N4, Si
Sample Size 6" (150mm)
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


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The Applied Materials P5000 PECVD system is a multi-chamber Plasma Enhanced Chemical Vapor Deposition (PECVD) tool. Chamber A is configured for highly conformal TEOS (SiO2) film deposition, but is not available for processing at this time. Chamber B is configured for SiO2 and a-Si film deposition with boron and phosphorous doping options. Chamber C is configured to deposit SiO2, Si3N4, and SiOxNy (oxynitride) films. The tool has a cassette load station for 150mm diameter wafers. Processing of 100mm diameter and smaller samples will be enabled by use of carrier wafers with a 100mm diameter recessed area. Wafers are transferred to the process chambers and are processed one at a time with deposition on only the top side of the substrate. Standard recipes operate at 200-400C. Substrate heating is accomplished by lamps located under the susceptor that the wafer rests on during processing. This system has a single frequency RF power source at 13.56MHz that is delivered to the chamber through an auto-matching network.

Announcements

  • Update this with announcements as necessary

Capabilities

  • Etch Rate
  • Resolution
  • Aspect Ratio
  • Thickness range

System Overview

Hardware Details

  • Gases
  • Pressure
  • Chuck
  • Chamber
  • RF / Power Specs
  • Chemicals

Substrate Requirements

  • Wafer Size
  • Wafer type
  • Any mounting?
  • Wafer thickness

Material Restrictions

The P5000 PECVD is designated as a Semi-Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported Processes

There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.

In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on P5000 PECVD User Processes. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Standard Operating Procedure

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Checkout Procedure

  1. Read through this page and the Standard Operating Procedure above.
  2. Complete the training request form here.
  3. Create a Helpdesk Ticket requesting training.
  4. A tool engineer will schedule a time for initial training.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the SOP quiz here.
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.

Tool Qualification

Process Name