PMGI SF 6

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About this Process
Process Details
Equipment	PMGI SF 6
Technology	Lift-off

PGMI SF 6 is a lift-off resist polydimethylglutarimide (PMGI) that is desinged for lift-off process and sacrificial release layers. It is used in combination with conventional photo resist to create and undercut or step feature facilitating clean and easy liftoff minimizing, or eliminating stringers and edge roughness.

Procedure

Notes

• These recipes are for 2um contact resolution and 1um stepper resolution.
• These recipes will be for 3500Å (2000rpm open lid and 1500rmp closed lid) of SF6, allowing you to lift off upto 2800Å of metal.
• These are all for Si. Other materials will have different reflections and this may impact the required exposures.
• The thickness of the SF affects the required exposure time for the stepper and contact alingers.
• The thickness of the SF6 affects the 955 swing curve so deviating from this thickness for stepper exposure can have unexpected results.

Process

• Spin SF 6 on CEE 100 at desired speed.
• Bake for 5min at 190°C, lid down on hotplates in 1440C

Contact Aligners

SPR 220 3.0 process

• Spin SPR 220 3.0
  • 3K spin
  • 3um RRD on the ACS
• Bake at 115°C for 90 seconds
• Expose for 7 seconds
• Develop
  • 30 sec MIF 300 spray develop on the ACS
  • DP 25-25 726 puddle develop on the CEE developers

1813 Process

• Spin 1813 at 4K spin (recipe #4 on CEE spinners)
• Bake for @110°C for 4 min on hotplate
• Expose 4.0-4.5 seconds with 20 mJ/sec broad band light
• Develop
  • 30 sec MIF 300 spray develop on the ACS
  • DP 20-20 726 puddle develop on the CEE developers

Stepper

Coming soon.

Characterization

Spin Curve

PMGI SF 6 spin curve on CEE 100.

Affects of develop time

1813/LOR System

Spray Develop

Puddle Develop