View source for PVD 75 Proline

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[[Sputter_deposition|< Sputter deposition]]
{{#vardefine:toolid|87001}} {{#vardefine:technology|PVD}} {{#vardefine:restriction|3}}
{{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Aluminum|Al]], [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Chromium|Cr]],  [[Copper|Cu]],[[Cobalt|Co]],[[Iron|Fe]], [[Nickel|Ni]],[[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Silver|Ag]],[[Titanium|Ti]],[[Tungsten|W]]
|mask = 
|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N<sub>2</sub>]], [[O2|O<sub>2</sub>]]
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = <!--[[STS_Pegasus_4/Processes|Supported Processes]]-->
|userprocesses = <!--[[LNF_User:STS_Pegasus_4_User_Processes|User Processes]]-->
}}
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The PVD 75 Proline is a magnetron [[sputter deposition]] tool for depositing conductive metallic and non conductive dielectric films. The PVD 75 tool is designed specifically for '''point of use processing of materials not allowed or not currently in the Lab 18 tools.'''  Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features. 

==Announcements==
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[https://docs.google.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1242670380| Materials immediately available Link]

==Capabilities==

*Materials for deposition can be changed each reservation
*Samples loaded directly into the process chamber
*Oxygen (O<sub>2</sub>) and Nitrogen (N<sub>2</sub>) reactive film capabilities

==Supported Processes== 
*[[{{BASEPAGENAME}}/Processes]]

Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].

If you have a material deposition need that is not listed, check to see if this material is deposited on another PVD tool or see more about options for running your own private material on the [[LNF PVD Films|LNF PVD Films]] page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.

===Process Name===
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Multiple staff characterized films are available.    If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.

{| class="wikitable" border="1"
|-
!Material
!Max thickness (Run/Reservation)
!
|-
|Aluminum ([[Aluminum|Al]])
|3000Å / 1 µm
|-
|Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
|500Å / 3000Å
|-
|Chromium ([[Chromium|Cr]])
|3000Å / 9000Å
|-
<!--| Copper ([[Copper|Cu]])
| 1000Å / 5000Å
|--->
<!--| Germanium ([[Germanium|Ge]])
| 4000 Å / NA
|--->
|-
<!--|Gold ([[Gold|Au]])
| 5000Å / NA
|--->
|Iron ([[Iron|Fe]])
|2000Å / 6000Å
|-
|Nickel ([[Nickel|Ni]])
|2000 Å / 6000Å
|-
| Molybdenum ([[Molybdenum|Mo]])
| 3000 Å / 8000 Å
|--->
<!--| Platinum ([[Platinum|Pt]])
| 5000 Å / 1 µm
|--->
|Silver ([[Silver|Ag]])
|3000 Å / 6000Å
|-
|Silicon ([[Silicon|Si]])
|3000 Å / 6000Å
|-
|Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
|1000 Å / 3000Å
|-
|Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])
|500 Å / 1000Å
|-
<!--| Tantalum ([[Tantalum|Ta]])
| 2000 Å / NA
|--->
|Titanium ([[Titanium|Ti]])
|3000 Å / 6000 Å
|-
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
| 2000 Å / 5000 Å
|--->
|Tungsten ([[Tungsten|W]])
|3000 Å / 9000 Å
|-
<!--| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
| 3000 Å / 8000 Å
|--->
|}

==System Overview==
The PVD 75 is an Argon sputter deposition tool that uses Tourus Mag Kepper magnetrons powered by RF, DC, and Pulsed DC power supplies. Deposition rates are between 0.1 and 11 A/sec, with most being close to 2 A/sec. An additional Rf power supply on the substrate platen allows for in situ sample cleans, and bias voltage. Quartz heater lamps behind the sample holder can be use to heat samples up to 300°C. The average run time on this tool per wafer is  about two hours.

===Hardware Details===

*Cryo pumped chamber – lower 10<sup>-6</sup> Torr base pressure
*Chamber capacity: single wafer
*Sample heating – up to 300°C
**Four 3” Sputtering Guns
**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)

===Substrate Requirements===

*Sample sizes: pieces, up to 6” wafers.
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
**Diameter 150 mm maximum
**Substrates up to 4 mm Thick. With special fixture up to 8 mm.
**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]

===Material Restrictions===
{{material restrictions}}

==Standard Operating Procedure==
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==Checkout Procedure==
For more details, see [[KJLC Sputter Tool Access and Training]].
# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
# Read through this Wiki page and the Operating Procedure above.
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training
# A tool engineer or user services member will contact you for a training session.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.

==Maintenance==
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].