Difference between revisions of "PVD 75 Proline"

From LNF Wiki
Jump to navigation Jump to search
 
(20 intermediate revisions by 5 users not shown)
Line 5: Line 5:
 
{{infobox equipment
 
{{infobox equipment
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
 
|restriction = [[{{PAGENAME}}#Material_Restrictions|Semi-Clean]]
|materials = [[Aluminum|Al]], [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Chromium|Cr]],  [[Iron|Fe]], [[Nickel|Ni]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Silver|Ag]],[[Titanium|Ti]]
+
|materials = [[Aluminum|Al]], [[Al2O3|Al<sub>2</sub>O<sub>3</sub>]], [[Chromium|Cr]],  [[Copper|Cu]],[[Cobalt|Co]],[[Iron|Fe]], [[Nickel|Ni]],[[Molybdenum|Mo]], [[Silicon|Si]], [[Silicon Dioxide|SiO<sub>2</sub>]], [[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]], [[Silver|Ag]],[[Titanium|Ti]],[[Tungsten|W]]
 
|mask =  
 
|mask =  
 
|size = 150mm x 4mm and smaller samples
 
|size = 150mm x 4mm and smaller samples
Line 15: Line 15:
 
}}
 
}}
 
<!-- Insert the tool description here -->
 
<!-- Insert the tool description here -->
The PVD 75 Proline is a magnetron [[sputter deposition]] tool for depositing conductive metallic and non conductive dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.  
+
The PVD 75 Proline is a magnetron [[sputter deposition]] tool for depositing conductive metallic and non conductive dielectric films. The PVD 75 tool is designed specifically for '''point of use processing of materials not allowed or not currently in the Lab 18 tools.'''  Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.  
  
 
==Announcements==
 
==Announcements==
 
<!-- *Update this with announcements as necessary -->
 
<!-- *Update this with announcements as necessary -->
*The target change process on this tool is a user supported process. That can be completed during the tool reservation when the chamber is vented to load samples.
+
 
 +
*[https://docs.google.com/spreadsheets/d/1yMY0SG8PDlF4UWxz96uJVnmP9mcxYr0wGc1xmzmgF48/edit#gid=1886308597| LNF Sputter Calendar]
  
 
==Capabilities==
 
==Capabilities==
* Computer controlled recipes
 
* Non load lock configuration
 
* limited film stress versatility with in film development.
 
* Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
 
  
==System Overview==
+
*Computer controlled recipes
The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is  about two hours.
+
*Non load lock configuration
 +
*limited film stress versatility with in film development.
 +
*Reactive film capabilities (Ar, O<sub>2</sub>, and N<sub>2</sub>)
  
===Hardware Details===
+
==Supported Processes==  
*Cryo pumped chamber – upper 10<sup>-7</sup> Torr base pressure
+
*[[{{BASEPAGENAME}}/Processes]]
*Chamber capacity: single wafer
 
*Configured with port for future load lock
 
*Sample heating – up to 350°C
 
**Four 3” Sputtering Guns
 
**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)
 
  
===Substrate Requirements===
+
Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
*Sample sizes: pieces, up to 6” wafers.
 
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
 
** Diameter 150 mm maximum
 
** Substrates up to 4 mm Thick. With special fixture up to 8 mm.
 
** [https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 
 
 
===Material Restrictions===
 
{{material restrictions}}
 
  
==Supported Processes==
+
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.  
Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see [[{{BASEPAGENAME}}/Processes]].
 
  
In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes. Wondering if your material can be deposited in this tool, please contact the tool engineers via the helpdesk ticket system. See the more about privately supported materials on the [[LNF_Sputter_Adding_New_Films|LNF Sputtering Adding New Films]] page.
+
If you have a material deposition need that is not listed, check to see if this material is deposited on another PVD tool or see more about options for running your own private material on the [[LNF PVD Films|LNF PVD Films]] page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to [http://lnf-wiki.eecs.umich.edu/wiki/LNF_PVD_Films#Requesting_to_Add_New_PVD_Materials Request New PVD Films] here. See more on how to request new sputter sources specifically on the [https://lnf-wiki.eecs.umich.edu/wiki/LNF_Sputter_Adding_New_Films LNF Sputter Adding New Films] page.
  
 
===Process Name===
 
===Process Name===
Line 61: Line 46:
 
{| class="wikitable" border="1"
 
{| class="wikitable" border="1"
 
|-
 
|-
! Material
+
!Material
! Max thickness (Run/Reservation)
+
!Max thickness (Run/Reservation)
!  
+
!
 
|-
 
|-
| Aluminum ([[Aluminum|Al]])
+
|Aluminum ([[Aluminum|Al]])
| 3000Å / 1 µm
+
|3000Å / 1 µm
 
|-
 
|-
| Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
+
|Alumina/Aluminum Oxide ([[Al2O3|Al<sub>2</sub>O<sub>3</sub>]])
| 500Å / 3000Å
+
|500Å / 3000Å
 
|-
 
|-
| Chrome ([[Chrome|Cr]])
+
|Chromium ([[Chromium|Cr]])
| 3000Å / 9000Å
+
|3000Å / 9000Å
 
|-
 
|-
 
<!--| Copper ([[Copper|Cu]])
 
<!--| Copper ([[Copper|Cu]])
Line 84: Line 69:
 
| 5000Å / NA
 
| 5000Å / NA
 
|--->
 
|--->
| Iron ([[Iron|Ir]])
+
|Iron ([[Iron|Fe]])
| 2000Å / 6000Å  
+
|2000Å / 6000Å
 
|-
 
|-
| Nickel ([[Nickel|Ni]])
+
|Nickel ([[Nickel|Ni]])
| 2000 Å / 6000Å  
+
|2000 Å / 6000Å
 
|-
 
|-
<!--| Molybdenum ([[Molybdenum|Mo]])
+
| Molybdenum ([[Molybdenum|Mo]])
| 2000 Å / 8000 Å
+
| 3000 Å / 8000 Å
 
|--->
 
|--->
 
<!--| Platinum ([[Platinum|Pt]])
 
<!--| Platinum ([[Platinum|Pt]])
 
| 5000 Å / 1 µm
 
| 5000 Å / 1 µm
 
|--->
 
|--->
| Silver ([[Silver|Ag]])
+
|Silver ([[Silver|Ag]])
| 3000 Å / 6000Å
+
|3000 Å / 6000Å
 
|-
 
|-
| Silicon ([[Silicon|Si]])
+
|Silicon ([[Silicon|Si]])
| 3000 Å / 6000Å
+
|3000 Å / 6000Å
 
|-
 
|-
| Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
+
|Silicon Dioxide ([[Silicon Dioxide|SiO<sub>2</sub>]])
| 1000 Å / 3000Å
+
|1000 Å / 3000Å
 
|-
 
|-
| Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])
+
|Silicon Nitride ([[Silicon Nitride|Si<sub>3</sub>N<sub>4</sub>]])
| 500 Å / 1000Å
+
|500 Å / 1000Å
 
|-
 
|-
 
<!--| Tantalum ([[Tantalum|Ta]])
 
<!--| Tantalum ([[Tantalum|Ta]])
 
| 2000 Å / NA
 
| 2000 Å / NA
 
|--->
 
|--->
| Titanium ([[Titanium|Ti]])
+
|Titanium ([[Titanium|Ti]])
| 3000 Å / 6000 Å
+
|3000 Å / 6000 Å
 
|-
 
|-
 
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
 
<!--| Titanium Dioxide ([[Titanium Dioxide|TiO<sub>2</sub>]])
 
| 2000 Å / 5000 Å
 
| 2000 Å / 5000 Å
 
|--->
 
|--->
| Tungsten ([[Tungsten|W]])
+
|Tungsten ([[Tungsten|W]])
| 3000 Å / 9000 Å
+
|3000 Å / 9000 Å
 
|-
 
|-
 
<!--| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
 
<!--| Tungsten/Titanium ([[Tungsten/Titanium|W-Ti]])
Line 124: Line 109:
 
|--->
 
|--->
 
|}
 
|}
 +
 +
==System Overview==
 +
The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is  about two hours.
 +
 +
===Hardware Details===
 +
 +
*Cryo pumped chamber – lower 10<sup>-6</sup> Torr base pressure
 +
*Chamber capacity: single wafer
 +
*Configured with port for future load lock
 +
*Sample heating – up to 350°C
 +
**Four 3” Sputtering Guns
 +
**2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)
 +
 +
===Substrate Requirements===
 +
 +
*Sample sizes: pieces, up to 6” wafers.
 +
*Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
 +
**Diameter 150 mm maximum
 +
**Substrates up to 4 mm Thick. With special fixture up to 8 mm.
 +
**[https://docs.google.com/document/d/1p8k5awL8j_HvGESUDsE80uE2obIYRb_8AiQzlfoDT3Q/edit#|Sputter Sample Mounting]
 +
 +
===Material Restrictions===
 +
{{material restrictions}}
  
 
==Standard Operating Procedure==
 
==Standard Operating Procedure==
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
 
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=1WXj9Ykp4t0WAS3hdYazaYHId4eNTV7hPJ0_bKtfasjE}}
+
{{#widget:GoogleDoc|key=1vf2enLWa1qMT0sAis9bUFoyuTnNjLszRxbj0Rkh4trw}}
  
 
==Checkout Procedure==
 
==Checkout Procedure==
The PVD 75 is on the [[LNF Scheduler]]. LNF constituents may reserve time on the tool, and even request staff support for process development.
 
<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->
 
 
For more details, see [[KJLC Sputter Tool Access and Training]].
 
For more details, see [[KJLC Sputter Tool Access and Training]].
# Complete the following items
+
# Complete the online [https://rise.articulate.com/share/Ao7oMeRC8efjEeqElzqlBiPE6uyJ9y-T#/ PVD Rise Training] (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
#*Read the Standard Operating Procedure above
+
# Read through this Wiki page and the Operating Procedure above.
#*Review all of the Wiki pages associated with this tool
+
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training
#*[https://docs.google.com/presentation/d/1nO94aGlw5j6rmivVmY-nPCghMDGjSD-8RN413huMWmI/edit?usp=sharing| PVD 75 Tool Verification]
+
# A tool engineer or user services member will contact you for a training session.
#*[https://docs.google.com/document/d/1vf2enLWa1qMT0sAis9bUFoyuTnNjLszRxbj0Rkh4trw/edit?usp=sharing| PVD 75 User Detailed Procedure]
 
#*[https://docs.google.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]
 
<!--==#*<iframe src="https://docs.google.com/presentation/d/1nO94aGlw5j6rmivVmY-nPCghMDGjSD-8RN413huMWmI/embed?start=true&loop=false&delayms=3000" frameborder="0" width="480" height="299" allowfullscreen="true" mozallowfullscreen="true" webkitallowfullscreen="true"></iframe>==-->
 
<!--# Complete the training request form [<link> here]. -->
 
# Create a helpdesk ticket requesting training.
 
# A tool engineer will schedule a time for initial training.
 
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
 
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
<!--# Complete the SOP quiz [<link> here]. -->
+
# Complete the [https://docs.google.com/forms/d/e/1FAIpQLSejdgAcE9d7_fgmUWHDxykaoB4GpflVnP9anXV2gMXnoUscGw/viewform?embedded=true#start=embed| PVD 75 User Training Quiz]
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
+
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.
 
 
<!--==Tool Qualification== -->
 
<!-- Describe standard maintenance/qualification tests here -->
 
  
 
==Maintenance==
 
==Maintenance==
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].
 
For more details, see [[{{BASEPAGENAME}}/Maintenance and qualification]].

Latest revision as of 11:35, 23 May 2022

< Sputter deposition

PVD 75 Proline
87001.jpg
Equipment Details
Technology PVD
Materials Restriction Metals
Material Processed Al, Al2O3, Cr, Cu,Co,Fe, Ni,Mo, Si, SiO2, Si3N4, Ag,Ti,W
Sample Size 150mm x 4mm and smaller samples
Gases Used Ar, N2, O2
Equipment Manual


The PVD 75 Proline is a magnetron sputter deposition tool for depositing conductive metallic and non conductive dielectric films. The PVD 75 tool is designed specifically for point of use processing of materials not allowed or not currently in the Lab 18 tools. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.

Announcements

Capabilities

  • Computer controlled recipes
  • Non load lock configuration
  • limited film stress versatility with in film development.
  • Reactive film capabilities (Ar, O2, and N2)

Supported Processes

Basic "User" access with the Lab 18's provide researchers the ability to load, transfer samples, and deposit standard characterized materials. For more details, see PVD 75 Proline/Processes.

In addition to these, this tool has a number of user-supported recipes for depositing a wide variety of materials. Some of these recipes are documented on User Processes.

If you have a material deposition need that is not listed, check to see if this material is deposited on another PVD tool or see more about options for running your own private material on the LNF PVD Films page. The PVD 75 Proline is the preferred sputtering tool for non-standard materials. See how to Request New PVD Films here. See more on how to request new sputter sources specifically on the LNF Sputter Adding New Films page.

Process Name

Multiple staff characterized films are available. If two thicknesses are listed the first is for per run and the second thickness is for total material used per reservation.

Material Max thickness (Run/Reservation)
Aluminum (Al) 3000Å / 1 µm
Alumina/Aluminum Oxide (Al2O3) 500Å / 3000Å
Chromium (Cr) 3000Å / 9000Å
Iron (Fe) 2000Å / 6000Å
Nickel (Ni) 2000 Å / 6000Å
Molybdenum (Mo) 3000 Å / 8000 Å
Silver (Ag) 3000 Å / 6000Å
Silicon (Si) 3000 Å / 6000Å
Silicon Dioxide (SiO2) 1000 Å / 3000Å
Silicon Nitride (Si3N4) 500 Å / 1000Å
Titanium (Ti) 3000 Å / 6000 Å
Tungsten (W) 3000 Å / 9000 Å

System Overview

The PVD 75 has a 14" square-shaped chamber high vacuum process chamber. The tools four Tourus Mag Kepper magnetron sputtering sources are set up to allow for RF, DC, Pulse DC and DC co-sputtering. There is an additional Rf power supply on the substrate platen to allow for in situ sample cleans, and bias voltage to manipulate the film characteristics. Sample heating up to 350°C is achieved by using the tools quartz heater lamps. The average run time on this tool per wafer is about two hours.

Hardware Details

  • Cryo pumped chamber – lower 10-6 Torr base pressure
  • Chamber capacity: single wafer
  • Configured with port for future load lock
  • Sample heating – up to 350°C
    • Four 3” Sputtering Guns
    • 2 DC (one pulse DC source) and 2 RF power supply (one for sample RF bias)

Substrate Requirements

  • Sample sizes: pieces, up to 6” wafers.
  • Wafer holders available for 2", 3", 4", 6"; as well as clip fixtures for smaller pieces
    • Diameter 150 mm maximum
    • Substrates up to 4 mm Thick. With special fixture up to 8 mm.
    • Sample Mounting

Material Restrictions

The PVD 75 Proline is designated as a Metals class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Standard Operating Procedure

Widget text will go here.

Checkout Procedure

For more details, see KJLC Sputter Tool Access and Training.

  1. Complete the online PVD Rise Training (this only needs to completed once so if you are authorized on another PVD tool or sputter tool, you do not need to do it again.)
  2. Read through this Wiki page and the Operating Procedure above.
  3. Create a Helpdesk Ticket requesting training
  4. A tool engineer or user services member will contact you for a training session.
  5. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  6. Complete the PVD 75 User Training Quiz
  7. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool at the "user" level.

Maintenance

For more details, see PVD 75 Proline/Maintenance and qualification.