Difference between revisions of "Parylene C"
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==Processing Equipment== | ==Processing Equipment== | ||
| − | ===Deposition=== | + | ===Deposition Equipment=== |
* [[SCS_PDS_2035CR]] | * [[SCS_PDS_2035CR]] | ||
| − | ===Etching=== | + | ===Etching Equipment=== |
Similar to other polymers, parylene can be etched isotropically with an O<sub>2</sub> plasma. | Similar to other polymers, parylene can be etched isotropically with an O<sub>2</sub> plasma. | ||
* [[Plasmatherm 790]] | * [[Plasmatherm 790]] | ||
| Line 19: | Line 19: | ||
* [[YES Plasma Stripper]] | * [[YES Plasma Stripper]] | ||
* [[Deep UV SenLights PL16]] | * [[Deep UV SenLights PL16]] | ||
| + | ===Characterization Equipment=== | ||
| + | * Thickness | ||
| + | **[[Woollam M-2000 Ellipsometer]] | ||
| + | **[[NanoSpec 6100]] Interferometer | ||
| + | *Material Physical Properties | ||
| + | **[[Woollam M-2000 Ellipsometer]] | ||
| + | **[[Rame-Hart Goniometer]] | ||
| + | ==Applications== | ||
| + | Common uses of Parylene C are | ||
| + | *Coating on devices to make them more Bio Compatible | ||
| + | *Soft structural material for Bio mems. | ||
| − | == | + | ==Processes== |
| + | ===Deposition Processes=== | ||
| + | * [[Parylene deposition]] | ||
| + | ===Etching Processes=== | ||
| + | *[[RIE|RIE Etch]] | ||
| + | **Parylene etches are O2 based and etch photoresits at a similar rates. | ||
| + | **Hard masks of [[Aluminum]] or Silicon dioxide are often used. | ||
| − | * [[ | + | ===Characterization Processes=== |
| + | *[[Ellipsometry]] | ||
| + | *[[Spectroscopic reflectometry]] | ||
| + | *[[Contact angle measurements]] | ||
| − | * | + | ==Relevant Material Information== |
| + | *[[Contact angle measurements]] | ||
[[File:Parylene contact angle 2.png|300px|Contact angle of Water on Parylene]]<br> | [[File:Parylene contact angle 2.png|300px|Contact angle of Water on Parylene]]<br> | ||
| − | a)Schematic that shows the static contact angles b) Photograph of a water droplet on a Parylene C film<br> | + | a)Schematic that shows the static contact angles b) Photograph of a water droplet on a Parylene C film.<br> |
| + | As with other polymers, the hydrophilicity of the surface can be changed by exposing the sample to an oxygen plasma <ref>https://www.sciencedirect.com/science/article/pii/S0928493113003731</ref> <br><br> | ||
| + | Below a list of useful information when considering the use of Parylene, taken from [https://www.diamond-mt.com/parylene_conformal_coating_solutions.html Diamond-mf.com] | ||
*Room temperature formation means the coatings are effectively stress-free | *Room temperature formation means the coatings are effectively stress-free | ||
*Parylene is chemically and biologically inert and stable and make excellent barrier material. | *Parylene is chemically and biologically inert and stable and make excellent barrier material. | ||
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[[File:Parylene C FTIR.png|300pxl| Parylene C thin film FTIR spectrum]]<br> | [[File:Parylene C FTIR.png|300pxl| Parylene C thin film FTIR spectrum]]<br> | ||
Parylene C thin film FTIR Spectrum from reference above. | Parylene C thin film FTIR Spectrum from reference above. | ||
| + | |||
| + | ==References== | ||
Latest revision as of 10:42, 9 April 2020
Parylene C, a chlorinated poly(para-xylylene) polymer, is widely employed as a biocompatible, corrosion-resistant coating, as a packaging material, and as an optically transparent material. Parylene conformal coatings are ultra-thin, pinhole-free polymer coatings that provide a number of high-value surface treatment properties such as excellent moisture, chemical and dielectric barrier properties, thermal and UV stability, and dry-film lubricity. These properties make Parylene coatings the ideal choice for a number of applications throughout the medical device, electronics, transportation, defense and aerospace industries.
Contents
Processing Equipment
Deposition Equipment
Etching Equipment
Similar to other polymers, parylene can be etched isotropically with an O2 plasma.
- Plasmatherm 790
- LAM 9400
- mnf_parylene_fast_iso
- mnf_parylene_slow_iso
- rh_parylene
- STS Glass Etcher
- YES Plasma Stripper
- Deep UV SenLights PL16
Characterization Equipment
- Thickness
- Woollam M-2000 Ellipsometer
- NanoSpec 6100 Interferometer
- Material Physical Properties
Applications
Common uses of Parylene C are
- Coating on devices to make them more Bio Compatible
- Soft structural material for Bio mems.
Processes
Deposition Processes
Etching Processes
- RIE Etch
- Parylene etches are O2 based and etch photoresits at a similar rates.
- Hard masks of Aluminum or Silicon dioxide are often used.
Characterization Processes
Relevant Material Information
a)Schematic that shows the static contact angles b) Photograph of a water droplet on a Parylene C film.
As with other polymers, the hydrophilicity of the surface can be changed by exposing the sample to an oxygen plasma [1]
Below a list of useful information when considering the use of Parylene, taken from Diamond-mf.com
- Room temperature formation means the coatings are effectively stress-free
- Parylene is chemically and biologically inert and stable and make excellent barrier material.
- Parylene has excellent electrical properties: low dielectric constant and loss with good high-frequency properties; good dielectric strength; and high bulk and surface resistance.
- Parylene has good thermal endurance: Parylene C performs in air without significant loss of physical properties for 10 years at 80°C and in the absence of oxygen to temperatures in excess of 200°C.
- Parylene is optically transparent and can be used to coat optical elements.
- FDA approved material
- Parylene coating has excellent mechanical properties, including high tensile strength.
- Parylene is stable over a very wide temperature range (-200 ‘C to +200 ‘C), allowing the chamber items coated in Parylene to be put in an autoclave
- Parylene is unaffected by solvents
Technical data
For complete information on Parylene C physical properties see: Parylene C TDS
Parylene C thin film FTIR Spectrum from reference above.
