Photoresist
Photoresist is a photoactive polymer suspended in a solvent used in Lithography processing. We have positive novolak based resists for use with our mask aligners and stepper, negative epoxy based resists ..... and e-beam resists for use with the JOEL.
Contents
LNF Supported Photoresists
UV Exposure
- SPR 220
- SPR 220 (3.0) is stocked in the cleanroom, SPR 220 (7.0) can be purchased from the store
- SPR 955
- SPR 955 (0.9) can be purchased in the store
- S1800
- 1813 is stocked in the cleanroom and can be purchased from the store
- KMPR
- KMPR 1010 and 1025 can be purchased from the store
- SU-8
- ???
E-Beam
- ZEP
- PMMA 450
- PMMA 950
Applications
Etch
RIE
A photoresist used in RIE needs to be thermally stable and resistant to the etch chemistry.
- SPR 220 - 3µm of SPR 220 is the most common etch mask at the LNF.
- SPR 955 - 0.97µm of SPR 955 allows a higher resolution then SPR 220 when a thinner mask is acceptable.
- KMPR - KMPR is a negative epoxy based photoresist with a very good etch resistance, but is more difficult to pattern and remove.
- ZEP - This is an e-beam photoresist that generally has much better etch resistance then PMMA
- PMMA 950 - PMMA can be used as an RIE mask, but will generally etch several times faster then the SPR series.
Wet Etch
A photoresists adhesion is very important as any adhesion failure greatly increases undercut.
- S1800 - XXX of 1813 is our standard wet etch mask due to XXX
Deposition
Lift Off
Liftoff needs a photoresist profile that prevents sidewall deposition from bridging the film. Generally this is done by using a bi-layer stack and undercutting the bottom layer...
- 1813 on LOR
- PMMA 950 on PMMA 450
Plating
Molding
Below you can find a list of public and private approved photoresists for the LNF. If you would like to bring a new photoresist into the robin lab or clean room, then please create a help desk ticket or email info@lnf.umich.edu. All photoresists must be handled using the green polychloroprene gloves.
Announcements
- None at this time.
Photoresist Table
| Photoresists | ||||||
|---|---|---|---|---|---|---|
| Photoresist | LNF/Private | Tool | +/-/Reversible | Stored | Notes | |
| 950K PMMA 6% | LNF | E-Beam Spinner | ? | Photoresist cabinet 1440C; 1480 photoresist | - | |
| AZ5214-E (IR) | Private | Not using | +, Reversible | No longer stored | - | |
| AZ9260 | Sold through store | ? | + | ? | Thick photoresist, high resolution | |
| KMPR 1010 | Private | CEE 100CB Spinner | - | ? | UV, E-beam, x-ray, contact aligner | |
| KMPR 1025 | Private | CEE 100CB Spinner | - | ? | UV, E-beam, or x-ray | |
| LOR 10B Lift-Off Resist | Private | CEE 100CB Spinner | - | ? | - | |
| Omni Coat | ? | ? | ? | ? | - | |
| S1813 | LNF | CEE 100 and CEE 200 Spinners | + | Photoresist cabinet 1440C | - | |
| SC1827 | LNF/discontinued | CEE 100 and CEE 200 Spinners | + | Photoresist cabinet 1440C | - | |
| SPR 220-3.0 | LNF | ACS 200 Cluster Tool, CEE 100 and CEE 200 Spinners | + | Photoresist cabinet 1440C | - | |
| SPR 220-7.0 | LNF/Private | CEE 100 and CEE 200 Spinners | + | Photoresist cabinet 1440C | LNF provides the photoresist for the CEE 200CB Spinner #1, but it must be purchased if you want to use it on the CEE 100CB Spinner | |
| SPR 955-0.9 | LNF | ACS 200 Cluster Tool, CEE 100 and CEE 200 Spinners | + | Photoresist cabinet 1440C | Thinner viscosity, higher resolution | |
| SU-8 2010 | ? | ROBIN Lab | - | Epoxy photoresist for micromachining | ||
| SU-8 2005 | ? | ROBIN Lab | - | Epoxy photoresist for micromachining | ||
| SU-8 2050 | ? | ROBIN Lab | - | Epoxy photoresist for micromachining | ||
