Difference between revisions of "Plasmatherm 790"
Jump to navigation
Jump to search
(Created page with "<!-- Set the resource ID, 5 digit # found on the scheduler --> <!-- Set the Process Technology (see subcategories on Equipment page) --> {{#vardefine:toolid|#####}} {{#vardefi...") |
|||
| Line 1: | Line 1: | ||
<!-- Set the resource ID, 5 digit # found on the scheduler --> | <!-- Set the resource ID, 5 digit # found on the scheduler --> | ||
<!-- Set the Process Technology (see subcategories on Equipment page) --> | <!-- Set the Process Technology (see subcategories on Equipment page) --> | ||
| − | {{#vardefine:toolid| | + | {{#vardefine:toolid|10030}} {{#vardefine:technology|RIE}} {{resource}} |
| − | {{#vardefine:technology| | ||
| − | {{resource}} | ||
| − | < | + | {{infobox equipment |
| + | |restriction = [[{{PAGENAME}}#Material_Restrictions|Metals]] | ||
| + | |materials = [[Si]], [[SiO2|SiO<sub>2</sub>]] | ||
| + | |mask = [[Photoresist|PR]], [[SiO2|SiO<sub>2</sub>]] | ||
| + | |gases = [[AR]], [[CH4|CH<sub>4</sub>]], [[CHF3|CHF<sub>3</sub>]], [[CF4|CF<sub>4</sub>]], [[H2|H<sub>2</sub>]], [[O2|O<sub>2</sub>]], [[SF6|SF<sub>6</sub>]] | ||
| + | |overview = [[{{PAGENAME}}#System_Overview | System Overview]] | ||
| + | |sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8/preview SOP] | ||
| + | |processes = [[{{PAGENAME}}/Processes|Supported Processes]] | ||
| + | |userprocesses = [[LNF_User:Plasmathem_790_User_Processes|User Processes]] | ||
| + | }} | ||
| + | |||
| + | {{warning|This page has not been released yet.}} | ||
<!-- Insert the tool description here --> | <!-- Insert the tool description here --> | ||
| − | + | The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD). | |
| + | |||
==Announcements== | ==Announcements== | ||
*Update this with announcements as necessary | *Update this with announcements as necessary | ||
| + | |||
| + | ==Capabilities== | ||
| + | <!--A more general description of what the tool is capable of doing.--> | ||
| + | * Etch Rate | ||
| + | * Resolution | ||
| + | * Aspect Ratio | ||
| + | * Thickness range | ||
| + | |||
==System Overview== | ==System Overview== | ||
| − | < | + | ===Hardware Details=== |
| − | + | * RIE Gases | |
| + | ** [[AR]] - 139 sccm | ||
| + | ** [[CH4|CH<sub>4</sub>]] - 18 sccm | ||
| + | ** [[CHF3|CHF<sub>3</sub>]] - 50 sccm | ||
| + | ** [[CF4|CF<sub>4</sub>]] - 42 sccm | ||
| + | ** [[H2|H<sub>2</sub>]] - 101 sccm | ||
| + | ** [[O2|O<sub>2</sub>]] - 100 sccm | ||
| + | ** [[SF6|SF<sub>6</sub>]] - 52 sccm | ||
| + | * PECVD Gases | ||
| + | ** [[AR]] | ||
| + | ** [[He]] | ||
| − | + | * Pressure | |
| − | * | + | * Chuck |
| − | * | + | * Chamber |
| − | * | + | * RF / Power Specs |
| − | * | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
===Substrate Requirements=== | ===Substrate Requirements=== | ||
| − | * | + | *RIE |
| − | ** | + | ** Up to 3 100 mm (4") wafers |
| − | ** | + | ** Pieces don't require mounting |
| + | *PECVD | ||
| + | ** 1 150 mm (6") wafer | ||
| + | ** 2 100 mm (4") wafers | ||
| + | ** Several pieces | ||
===Material Restrictions=== | ===Material Restrictions=== | ||
| Line 38: | Line 64: | ||
==Supported Processes== | ==Supported Processes== | ||
| − | |||
| − | |||
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page. | There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page. | ||
| − | |||
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. | In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. | ||
==Standard Operating Procedure== | ==Standard Operating Procedure== | ||
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". --> | <!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". --> | ||
| − | {{ | + | {{#widget:GoogleDoc|key=1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8}} |
==Checkout Procedure== | ==Checkout Procedure== | ||
<!-- Describe the checkout procedure for the tool. For example: --> | <!-- Describe the checkout procedure for the tool. For example: --> | ||
| − | # Read through the Standard Operating Procedure above. | + | # Read through this page and the Standard Operating Procedure above. |
# Complete the training request form [<link> here]. | # Complete the training request form [<link> here]. | ||
| − | # Create a | + | # Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. |
# A tool engineer will schedule a time for initial training. | # A tool engineer will schedule a time for initial training. | ||
# Practice with your mentor or another authorized user until you are comfortable with tool operation. | # Practice with your mentor or another authorized user until you are comfortable with tool operation. | ||
| Line 60: | Line 83: | ||
==Tool Qualification== | ==Tool Qualification== | ||
| − | + | Every other week a light cleaning is performed on the tool. A 5 min etch with mnf_oxide1 is performed on a 4" oxide wafer. The results can be seen below. | |
| − | |||
| − | |||
{{#widget:Iframe | {{#widget:Iframe | ||
| − | |url=https://docs.google.com | + | |url=https://docs.google.com/spreadsheets/d/1jDSV00jZ-1vppt2MgGRAJyXRvxEE3rJIlXtngODM9-0/pubchart?oid=1969686906&format=interactive |
|width=800 | |width=800 | ||
|height=400 | |height=400 | ||
|border=0 | |border=0 | ||
}} | }} | ||
Revision as of 14:50, 29 January 2015
| Plasmatherm 790 | |
|---|---|
 | |
| Equipment Details | |
| Technology | RIE |
| Materials Restriction | Undefined |
| Material Processed | Si, SiO2 |
| Mask Materials | PR, SiO2 |
| Gases Used | AR, CH4, CHF3, CF4, H2, O2, SF6 |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Supported Processes |
| User Processes | User Processes |
 Warning: | This page has not been released yet. |
The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD).
Contents
Announcements
- Update this with announcements as necessary
Capabilities
- Etch Rate
- Resolution
- Aspect Ratio
- Thickness range
System Overview
Hardware Details
- RIE Gases
- PECVD Gases
- Pressure
- Chuck
- Chamber
- RF / Power Specs
Substrate Requirements
- RIE
- Up to 3 100 mm (4") wafers
- Pieces don't require mounting
- PECVD
- 1 150 mm (6") wafer
- 2 100 mm (4") wafers
- Several pieces
Material Restrictions
Below is a list of approved and restricted materials for the tool. "Approved" means the material is allowed in the tool under normal circumstances. "Not Allowed" means the material may never be used in the tool. If a material is not listed, it may be possible to use the material under certain conditions. Please contact a tool engineer via the helpdesk ticket system for any material requests or questions.
Supported Processes
There are several processes for this tool supported by the LNF, which are described in more detail on the Processes page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:Plasmatherm 790 User Processes|]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
Standard Operating Procedure
Widget text will go here.
Checkout Procedure
- Read through this page and the Standard Operating Procedure above.
- Complete the training request form [<link> here].
- Create a Helpdesk Ticket requesting training.
- A tool engineer will schedule a time for initial training.
- Practice with your mentor or another authorized user until you are comfortable with tool operation.
- Complete the SOP quiz [<link> here].
- Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Tool Qualification
Every other week a light cleaning is performed on the tool. A 5 min etch with mnf_oxide1 is performed on a 4" oxide wafer. The results can be seen below.
