Plasmatherm 790/Processes/L O2 DSM
L_O2_DSM is an O2 etch designed for photoresist descumming.
About this Process | |
---|---|
Process Details | |
Equipment | Plasmatherm 790 |
Technology | RIE |
Material | SPR 220 |
Gases Used | O2 |
Contents
Parameters
Parameter | Etch |
---|---|
RF Power | 50 W |
Pressure | 200 mTorr |
O2 Flow | 75 sccm |