Difference between revisions of "Plasmatherm 790/Processes/L nit200"

From LNF Wiki
Jump to navigation Jump to search
Line 60: Line 60:
 
|}
 
|}
  
 +
Qualification is done with a 5 minute run, max allowed thickness of 2µm.
  
 
==Qualification==
 
==Qualification==

Revision as of 15:39, 26 March 2018

l_nit200 is a lower temp nitride deposition recipe for the Plasmatherm 790. It is optimized to have a stress near 25 MPa and an index of 2.0.

About this Process
Process Details
Equipment Plasmatherm 790
Technology PECVD
Material Si3N4
Gases Used SiH4, NH3, N2, He



Parameters

Parameter Dep
RF Power 150 W
Pressure 1500 mTorr
NH3 Flow 1.2 sccm
N2 Flow 200 sccm
He Flow 490 sccm
SiH4 Flow 5 sccm
Temperature 350°C

Capabilities

Parameter
Deposition Rate 5.6 Å/sec
Index of Refraction 2.00 ± 0.02
Stress 50 ± 50 MPa

Qualification is done with a 5 minute run, max allowed thickness of 2µm.

Qualification

Occasionally L_nit200 is tested on a 100 mm Si wafer. The results can be seen below.