Plasmatherm 790/Processes/L ox350R
L_OX350R is a 350 C oxide deposition recipe designed to reduce the film roughness by increasing the power. Currently more characterization is needed but roughness as low as 0.23 nm have been seen.
This section requires expansion with: This recipe needs further characterization..
|About this Process|
|Gases Used||SiH4, N2O, He|
|RF Power||150 W|
|SiH4 Flow||3.0 sccm|
|N2O Flow||200 sccm|
|He Flow||100 sccm|
|Deposition Rate||6.5 Å/sec|
|Index of Refraction||?|
Qualification is done with a 5 minute run, max allowed thickness of 2µm.