Plasmatherm 790/Processes/L oxy350

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l_on350 is a higher temp oxynitride deposition recipe for the Plasmatherm 790.

About this Process
Process Details
Equipment Plasmatherm 790
Technology PECVD
Material Oxynitride
Gases Used SiH4, N2O, He, NH3,


Parameter Dep
RF Power 150 W
Pressure 1500 mTorr
SiH4 Flow 5.0 sccm
N2 Flow 160 sccm
N20 Flow 10 sccm
NH3 Flow 1.43 sccm
He Flow 490 sccm
Temperature 350°C


Deposition Rate 6.3 Å/sec
Index of Refraction 1.65
Stress -30 MPa

Qualification is done with a 5 minute run, max allowed thickness of 2µm.