Plasmatherm 790/Processes/L oxy350
< Plasmatherm 790 | Processes
Jump to navigation
Jump to search
l_oxy350 is a higher temp oxynitride deposition recipe for the Plasmatherm 790.
About this Process | |
---|---|
Process Details | |
Equipment | Plasmatherm 790 |
Technology | PECVD |
Material | Oxynitride |
Gases Used | SiH4, N2O, He, NH3, |
Parameters
Parameter | Dep |
---|---|
RF Power | 150 W |
Pressure | 1500 mTorr |
SiH4 Flow | 5.0 sccm |
N2 Flow | 500 sccm |
N20 Flow | 10 sccm |
NH3 Flow | 1.5 sccm |
He Flow | 490 sccm |
Temperature | 350°C |
Capabilities
Parameter | |
---|---|
Deposition Rate | 6.9 Å/sec |
Index of Refraction | 1.63 |
Stress | 60 MPa |