Difference between revisions of "Plasmatherm 790/Processes/m pary1"
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==Limitations== | ==Limitations== | ||
The limitations for this recipe are still being defined. | The limitations for this recipe are still being defined. | ||
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Revision as of 10:02, 18 August 2021
m_pary1 is an O2 etch that can be used for parylene and other polymers.
About this Process | |
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Process Details | |
Equipment | Plasmatherm 790 |
Technology | RIE |
Material | Parylene |
Mask Materials | Photoresist |
Gases Used | O2 |
Contents
Parameters
Parameter | Etch |
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RF Power | 105 W |
Pressure | 100 mTorr |
O2 Flow | 99 sccm |
Capabilities
Etch Rate
Mask Selectivity
Sidewall Profile
- Undercut: ?
Limitations
The limitations for this recipe are still being defined.