Plasmatherm 790/Processes/m pary1
Jump to navigation Jump to search
|Warning:||This page has not been released yet.|
|About this Process|
m_pary1 is an O2 etch that can be used for parylene and other polymers.
|RF Power||105 W|
|O2 Flow||99 sccm|
- Parylene Etch Rate: XXX
- Undercut: XXX
Once a month m_pary1 is run on a XXX. This etch rate is reported in the chart below.
Then occasionally the recipe is tested on other materials as shown below.