Plasmatherm 790/Processes/m pary1
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Revision as of 13:44, 24 February 2015 by Wrightsh (talk | contribs) (→Qualification)
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|About this Process|
m_pary1 is an O2 etch that can be used for parylene and other polymers.
|RF Power||105 W|
|O2 Flow||99 sccm|
- Undercut: XXX
Once a month m_pary1 is run on a XXX. This etch rate is reported in the chart below.
Then occasionally the recipe is tested on other materials as shown below.