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Pyrex is a form of borosilicate glass with low thermal expansion. National Institute of Standards and Technology (NIST) describes borosilicate Pyrex as being composed of (% wt): 4.0% boron, 54.0% oxygen, 2.8% sodium, 1.1% aluminum, 37.7% silicon, and 0.3% potassium.
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
- Pyrex can be used as a substrate in many tools in the lab.
- Wet Etching
- Metrology/Characterization equipment available in the LNF for measuring physical, optical, and surface properties of this material.
- Borosilicate glass has many applications in the LNF. The LNF supplies:
- beakers and crystallizing dishes - they are resistant to chemicals and can handle heating
- Glass is also a common substrate and can be used for:
- List of technologies for depositing this material and relevant process information specific to this material associated with this equipment/type of process.
- Wet Etching
- Pyrex etching can be done using Buffered HF or Hydrofluoric acid.
- List of techniques for metrology/characterization can be used with this material and relevant process information specific to this material associated with this equipment/type of process.
Other Relevant Material Information
- Charts or specific LNF related data for this material.
- Citations/references for this material, review articles. If possible, examples of users publications which includes the material.